Photonic Integrated Circuits For Access System in Telecom

Informations projet

PIC-FAST

N° de convention de subvention: 101145256

DOI

10.3030/101145256

Date de signature de la CE 20 Février 2024

Date de début 1 Mars 2024

Date de fin 28 Février 2027

Financé au titre de

• The European Innovation Council (EIC)

Coût total

€ 3 491 968,75

Contribution de l’UE

€ 2 444 378,10

Coordonné par

PICADVANCED, SA
Portugal

Periodic Reporting for period 1 - PIC-FAST (Photonic Integrated Circuits For Access System in Telecom)

Période du rapport: 2024-03-01 au 2025-02-28

Résumé du contexte et des objectifs généraux du projet

The rapid proliferation of internet technologies, coupled with the growing number of users and devices, and the escalating bandwidth demands of applications and services, are imposing an unsustainable burden on networks and network operators. Consequently, this is resulting in decreased speeds and connectivity, among other issues. In this context, the EIC-funded PIC-FAST project aims to develop photonic integrated circuits (PICs) containing optical components to enhance scalability, reliability and efficiency further. Leveraging advancements in PIC design using optical network units, the project will facilitate a substantial and cost-efficient expansion of bandwidth. It will demonstrate usability and reduce environmental impact compared to current alternatives.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

The number of internet-enabled users, devices and bandwidth-hungry applications is increasing constantly, therefore, a new solution with less power consumption and more cost-effective – adopting the existing fibre optical network – is needed. Hence, to solve this technology barrier, photonic integrated circuits (PICs) are key.
The PIC-FAST project aims to achieve a 10Gbps technology solution (compliant with the NG-PON2 standard) on a commercial form-factor using PICs and integrating a microprocessor, thus combining the ONU and ONT into a single product. Besides the key advantages on energy efficiency, footprint and more available bandwidth to end-users, this approach will also open the path to the next generation optical technologies such as 25Gbps and 50Gbps.”

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

As during this mid-term analysis, PIC-FAST has advanced the integration of photonic circuits for both NG-PON2 and 50G PON standards, by exploring multiple PIC architectures and hybrid silicon-photonics approaches, paired with bespoke electronics, pluggable packaging, and on-prototype MAC firmware - these efforts were showcased in a 40 Gbps NG-PON2 demonstration and a preliminary 50G PON proof of concept at OFC 2025, both of them first of a kind in the industry.  By the end of the project, we will deliver a completed, qualified and demonstrated transceiver that with less optical components volume – when compared to a conventional BOSA module –, meanwhile it is more efficient and still meeting the compliance with NG-PON2 and 50G PON standards, ready for production scale-up. These developments aim to lower operators cost, enabling a cost-effective solution of higher speed for millions of homes and businesses, reducing CO2 emissions annually, and foster socioeconomic gains - from enhanced remote healthcare and education to boost the European photonics ecosystem and high-skilled job creation.

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