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Doctoral Training Network for Design of Resilient Systems-on-Chip

Objective

Reliable electronics is essential in safety- and mission-critical domains, such as space missions, aviation, automotive, wireless communications, data centers, healthcare, automated industry. With increase in complexity of Integrated Circuit (ICs), advancement in semiconductor technology and evolving market trends and application requirements, the IC design paradigm is shifting from classic “reliable systems” to “resilient systems”. A resilient IC has the ability to monitor its own state, detect and predict faulty scanarios, and perform self-reconfiguration/self-healing to maintain the required functionality. Besides ensuring enhanced reliability and safety, resilient systems aim to provide a balance between performance, fault tolerance and power consumption, resulting in extended system lifetime.

Given the strategic goal of EU to enhance its capacities in semiconductor domain (European Chips Act), as well as the shortage of highly skilled personnel for IC design, there is an urgent need for creating a new generation of skilled experts for ICs design. As the demand for safety- and mission-critical applications is projected to increase in coming years, particularly with new space missions and adoption of 6G wireless communications across numerous domains, special attention should be given to boosting the European capacities in the design of resilient Systems-on-Chip (SoC).

The RESYST-CHIP project will train 15 highly-skilled and entrepreneurially-oriented researchers in the design of resilient SoCs. The project brings together 20 leading research institutes, universities and companies, with the aim to address synergistically the critical challenges in 4 research domains - reliability characterization and modeling, CAD tools for resilience-by-design, on-chip sensing and analytics, and design of resilient architectures. The RESYST-CHIP network will employ a comprehensive training program combining complementary scientific and transferrable skills training.

Fields of science (EuroSciVoc)

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Keywords

Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)

Programme(s)

Multi-annual funding programmes that define the EU’s priorities for research and innovation.

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-TMA-MSCA-DN - HORIZON TMA MSCA Doctoral Networks

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-MSCA-2025-DN-01

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Coordinator

IHP GMBH - LEIBNIZ INSTITUTE FOR HIGH PERFORMANCE MICROELECTRONICS
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 870 816,96
Address
IM TECHNOLOGIEPARK 25
15236 Frankfurt Oder
Germany

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Region
Brandenburg Brandenburg Frankfurt (Oder)
Activity type
Research Organisations
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

No data

Participants (9)

Partners (10)