Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The ENIAC JU project EEMI450 brings together the major European specialists to start such work to maintain and extend their leading role in the development and production of semiconductor equipment and materials.
Fields of science
Call for proposal
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Funding SchemeJTI-CP-ENIAC - Joint Technology Initiatives - Collaborative Project (ENIAC)
BS 49 4AP Bristol