Objective
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The ENIAC JU project EEMI450 brings together the major European specialists to start such work to maintain and extend their leading role in the development and production of semiconductor equipment and materials.
Fields of science
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
Call for proposal
ENIAC-2009-1
See other projects for this call
Coordinator
1322 AP ALMERE
Netherlands
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Participants (26)
07745 JENA
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80686 Munchen
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01109 Dresden
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75007 PARIS
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75015 PARIS 15
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3001 Leuven
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BS 49 4AP Bristol
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81677 Munchen
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5504DR Veldhoven
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31700 Blagnac
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4782 St Florian Am Inn
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7261 AK Ruurlo
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01219 DRESDEN
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73463 Westhausen
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1117 BUDAPEST
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. LEIXLIP KILDARE
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5705 CS Helmond
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52134 Herzogenrath
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2595 DA Den Haag
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85391 ALLERSHAUSEN
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13790 Rousset
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89160 Dornstadt
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01237 DRESDEN
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38190 Bernin
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D-37077 Göttingen
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55129 MAINZ
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