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Content archived on 2024-04-15

High Yield and High Reliability ULSI System

Objective

The objective of the HYETI project was to develop the design methodology, design tools and architecture necessary to achieve high yields on ULSI (Ultra Large Scale Integration) and WSI (Wafer Scale Integration) integrated circuits. The yield models, specialised architectures and focused CAD tools required for reconfiguration at the end of manufacture were to be studied in this project. Because defect densities in modern process technology are such that working wafer scale circuits can only be manufacturedby introducing redundancy into a chip, enabling the defects to be avoided by reconfiguration during production, this work was of high value.
The need to produce a demonstrator to focus the many multi-discipline, interrelated facets of the WSI design problem was an important consideration from the start of the project.
The objective of the project was to develop the design methodology, design tools and architecture necessary to achieve high yields on ultra large scale integration (ULSI) and wafer scale integration (WSI) integrated circuits. The yield models, specialised architectures and focused computer aided design (CAD) tools required for reconfiguration at the end of manufacture were to be studied in this project.

As a conclusion to the work on yield analyses, the project found that the most satisfactory way to handle yield prediction for a specific topology is by graphic simulation. 2 architectures were selected for WSI implementation after a wide investigation: a 2-dimensional fast Fourier transform (FFT) processor and a processor array. After extensive investigation, the decision was taken during this preproject study to design and manufacture, in the follow up project, a 4 Mbit static random access memory (RAM), a systolic array and a reconfigurable 16-bit microprocessor.
As a conclusion to the work on yield analyses, the project found that the most satisfactory way to handle yield prediction for a specific topology is by graphic simulation.
Two architectures were selected for WSI implementation after a wide investigation: a 2-D Fast Fourier Transform (FFT) processor, and a processor array. After extensive investigation, the decision was taken during this pre-project study to design and manufacture, in the follow-up project, a 4 Mbit static RAM, a systolic array and a reconfigurable 16-bit microprocessor.
As this was just a one-year pre-project to investigate the feasibility of WSI, only limited results were achieved. The work, with an adjusted workplan and modification in the partnership, has been continued under project 824.

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Programme(s)

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Topic(s)

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

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Coordinator

SGS Thomson Microelectronics SA
EU contribution
No data
Address
17 avenue des Martyrs
38340 Grenoble
France

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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Participants (8)

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