Periodic Reporting for period 2 - Lotus MicroPower (The World’s Smallest Power Converters)
Período documentado: 2023-11-01 hasta 2025-09-30
Feature-rich electronic devices drive the demand for even higher power density dc-dc converters to minimize the overall size of the electronic device.
The current integrated power supply packaging technologies and materials do not allow further miniaturization. Moreover, existing technologies make extensive use of materials like copper and epoxy which are difficult and expensive to recycle and represent an environmental threat if disposed as-is.
Our patented silicon-based integration technology allows us to build substrates with three-dimensional (3D) structures that host power circuits, control circuits and passive components like inductors and capacitors in single miniaturized units.
Lotus MicroPower Project will help Lotus Microsystems to develop the necessary technologies to realize revolutionary power devices for current and future miniaturized electronic equipment.
The current integrated power supply packaging technologies and materials do not allow further miniaturization. Moreover, existing technologies make extensive use of materials like copper and epoxy which are difficult and expensive to recycle and represent an environmental threat if disposed as-is.
Our patented silicon-based integration technology allows us to build substrates with three-dimensional (3D) structures that host power circuits, control circuits and passive components like inductors and capacitors in single miniaturized units.
Lotus MicroPower Project will help Lotus Microsystems to develop the necessary technologies to realize revolutionary power devices for current and future miniaturized electronic equipment.
In this project we have developed major technologies for our products from TRL 3-4 to TRL 7-8.
During the reporting period, the project advanced the development of Lotus Microsystems’ next-generation power converter technologies. The technical activities focused on integrated circuit development, silicon interposer technology, and packaging and validation of miniaturized power modules.
The second-generation power converter IC progressed through design finalization and preparation for manufacturing, supported by improved wafer-level testing and validation methods. The first-generation IC continued to serve as a stable reference and enabled further architectural refinement.
Significant progress was achieved in developing the Power Interposer Technology (PIT) and the Active Power Interposer Technology (APIT). Key fabrication steps such as via formation, dielectric deposition, redistribution layers, and interconnect integration were demonstrated. Engineering samples of both PIT and APIT were produced and validated, confirming correct electrical functionality and readiness for further scaling.
Pilot and pre-production packaging runs of the LMU20P1 module were also completed. The assembled devices showed stable electrical performance, and full test programs were established to support yield analysis and optimization. A product evaluation board was developed to facilitate system-level testing and customer demonstrations.
Furthermore, our second-generation power module integration technology has been implemented in LBK0504. Paving the way to more advanced product development utilizing same manufacturing techniques and supply-chain.
Overall, the project delivered strong scientific and technical progress, with the integrated circuit, interposer technology, and package platform moving toward pre-production readiness and supporting the transition to final industrialization in the next phase.
During the reporting period, the project advanced the development of Lotus Microsystems’ next-generation power converter technologies. The technical activities focused on integrated circuit development, silicon interposer technology, and packaging and validation of miniaturized power modules.
The second-generation power converter IC progressed through design finalization and preparation for manufacturing, supported by improved wafer-level testing and validation methods. The first-generation IC continued to serve as a stable reference and enabled further architectural refinement.
Significant progress was achieved in developing the Power Interposer Technology (PIT) and the Active Power Interposer Technology (APIT). Key fabrication steps such as via formation, dielectric deposition, redistribution layers, and interconnect integration were demonstrated. Engineering samples of both PIT and APIT were produced and validated, confirming correct electrical functionality and readiness for further scaling.
Pilot and pre-production packaging runs of the LMU20P1 module were also completed. The assembled devices showed stable electrical performance, and full test programs were established to support yield analysis and optimization. A product evaluation board was developed to facilitate system-level testing and customer demonstrations.
Furthermore, our second-generation power module integration technology has been implemented in LBK0504. Paving the way to more advanced product development utilizing same manufacturing techniques and supply-chain.
Overall, the project delivered strong scientific and technical progress, with the integrated circuit, interposer technology, and package platform moving toward pre-production readiness and supporting the transition to final industrialization in the next phase.
The project has delivered several outcomes that advance the state of the art in miniaturized power conversion and silicon integration. The most visible result is the development of the smallest fully integrated boost converter power supply available today. This achievement represents a significant improvement in size, efficiency, and functional integration compared to current industry solutions.
Beyond the discrete product level, the project has also advanced two technology platforms with long-term impact. The Power Interposer Technology (PIT) provides a scalable approach to achieving higher power density through compact routing structures and vertical interconnects in silicon. The Active Power Interposer Technology (APIT) extends this concept by integrating interposer functionality directly with active power IC wafers, enabling power modules with a level of compactness and performance not achievable through conventional packaging.
To ensure full uptake and commercial success, several enabling conditions are identified. Continued research and process optimization are required to strengthen manufacturability, yield, and long-term reliability. Demonstration programs with early customers are essential to validate system-level performance and to tailor the technology to specific application requirements. Access to industrial manufacturing capacity and appropriate financing will also be necessary to support the transition from engineering samples to volume production. Ongoing development of the IP portfolio remains important to protect the technology and support future commercialization.
Overall, the project has produced results with strong potential for industrial and commercial impact, and it establishes a solid foundation for continued development and market introduction.
Beyond the discrete product level, the project has also advanced two technology platforms with long-term impact. The Power Interposer Technology (PIT) provides a scalable approach to achieving higher power density through compact routing structures and vertical interconnects in silicon. The Active Power Interposer Technology (APIT) extends this concept by integrating interposer functionality directly with active power IC wafers, enabling power modules with a level of compactness and performance not achievable through conventional packaging.
To ensure full uptake and commercial success, several enabling conditions are identified. Continued research and process optimization are required to strengthen manufacturability, yield, and long-term reliability. Demonstration programs with early customers are essential to validate system-level performance and to tailor the technology to specific application requirements. Access to industrial manufacturing capacity and appropriate financing will also be necessary to support the transition from engineering samples to volume production. Ongoing development of the IP portfolio remains important to protect the technology and support future commercialization.
Overall, the project has produced results with strong potential for industrial and commercial impact, and it establishes a solid foundation for continued development and market introduction.