Periodic Reporting for period 1 - Lotus MicroPower (The World’s Smallest Power Converters)
Período documentado: 2022-11-01 hasta 2023-10-31
Feature-rich electronic devices drive the demand for even higher power density dc-dc converters to minimize the overall size of the electronic device.
The current integrated power supply packaging technologies and materials do not allow further miniaturization. Moreover, existing technologies make extensive use of materials like copper and epoxy which are difficult and expensive to recycle and represent an environmental threat if disposed as-is.
Our patented silicon-based integration technology allows us to build a substrate for a 3-dimensional structure that hosts power circuits, control circuits and passive components like inductors and capacitors in single miniaturized units.
Lotus MicroPower will help Lotus Microsystems to develop the technologies to realize revolutionary power devices for current and future miniaturized electronic equipment.
The current integrated power supply packaging technologies and materials do not allow further miniaturization. Moreover, existing technologies make extensive use of materials like copper and epoxy which are difficult and expensive to recycle and represent an environmental threat if disposed as-is.
Our patented silicon-based integration technology allows us to build a substrate for a 3-dimensional structure that hosts power circuits, control circuits and passive components like inductors and capacitors in single miniaturized units.
Lotus MicroPower will help Lotus Microsystems to develop the technologies to realize revolutionary power devices for current and future miniaturized electronic equipment.