In this project we have developed major technologies for our products from TRL 3-4 to TRL 7-8.
During the reporting period, the project advanced the development of Lotus Microsystems’ next-generation power converter technologies. The technical activities focused on integrated circuit development, silicon interposer technology, and packaging and validation of miniaturized power modules.
The second-generation power converter IC progressed through design finalization and preparation for manufacturing, supported by improved wafer-level testing and validation methods. The first-generation IC continued to serve as a stable reference and enabled further architectural refinement.
Significant progress was achieved in developing the Power Interposer Technology (PIT) and the Active Power Interposer Technology (APIT). Key fabrication steps such as via formation, dielectric deposition, redistribution layers, and interconnect integration were demonstrated. Engineering samples of both PIT and APIT were produced and validated, confirming correct electrical functionality and readiness for further scaling.
Pilot and pre-production packaging runs of the LMU20P1 module were also completed. The assembled devices showed stable electrical performance, and full test programs were established to support yield analysis and optimization. A product evaluation board was developed to facilitate system-level testing and customer demonstrations.
Furthermore, our second-generation power module integration technology has been implemented in LBK0504. Paving the way to more advanced product development utilizing same manufacturing techniques and supply-chain.
Overall, the project delivered strong scientific and technical progress, with the integrated circuit, interposer technology, and package platform moving toward pre-production readiness and supporting the transition to final industrialization in the next phase.
