Objective
The demand for Pb-free solders in a green environment and the increasing requirements to miniaturize electronic goods are the two most critical considerations in the global electronics market. Such a two-fold critical requirement possesses a reliability t hreat in the selection of proper materials and processes as a state-of-the-art requirement of the electronics industries. Although many studies of Pb-free soldering have been performed recently, most of them are related to Surface Mount Technology(SMT) com ponents. In the case of SMT components, although a good joint reliability has been shown in most Pb-free solder joints, similar reliability is not expected in the area-array solder joints used for the Flip Chip(FC) and Ball Grid Array(BGA) packages. These solder joints, because of their tiny contact area and the limited volume of solder alloy, operate under more stressed conditions during mechanical/thermal shock loading. In particular, intermetallic compound (IMC) formation during soldering and subsequent aging (at the time of device operation) as well as higher tensile strength and lower elongation to failure of Pb-free solder than conventional Sn-Pb solder is likely to lead to easy crack initiation and propagation along the solder-IMC interface, which is a serious concern for electronic packaging scientists and engineers at this moment. The key objectives of the proposed project are as follows: a. To develop a finite element model capturing microstructural characteristics of area-array Pb-free solder joi nts where IMC volume is relatively higher. b. To establish a theoretical model to predict the reliability of a Pb-free solder joint. c. To understand the failure mechanisms of tiny Pb-free solder joints with the variation of the IMC characteristics. Along with the mathematical modeling, an experimental study will also be conducted. In this project, the researcher will gain training in computational mechanics and the use of finite element technology.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- natural sciences mathematics applied mathematics mathematical model
You need to log in or register to use this function
Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP6-2004-MOBILITY-7
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
IIF - Marie Curie actions-Incoming International Fellowships
Coordinator
GREENWICH, LONDON
United Kingdom
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.