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Contenido archivado el 2024-05-28

Advanced Surface Protection for Improved Reliability PCB Systems

Objetivo

To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and ionic liquid based electrolytes. To introdude these to the European PCB industry and to support the introductiuon of new standards around their use.

Convocatoria de propuestas

FP7-SME-2008-2
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Coordinador

THE INSTITUTE OF CIRCUIT TECHNOLOGY LIMITED LBG
Aportación de la UE
€ 447 167,00
Dirección
Forestfield 25
TD5 7BX KELSO
Reino Unido

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Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Contacto administrativo
Martin Trevor Goosey (Dr.)
Enlaces
Coste total
Sin datos

Participantes (10)