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Advanced Surface Protection for Improved Reliability PCB Systems

Ziel

To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and ionic liquid based electrolytes. To introdude these to the European PCB industry and to support the introductiuon of new standards around their use.

Aufforderung zur Vorschlagseinreichung

FP7-SME-2008-2
Andere Projekte für diesen Aufruf anzeigen

Koordinator

THE INSTITUTE OF CIRCUIT TECHNOLOGY LIMITED LBG
EU-Beitrag
€ 447 167,00
Adresse
Forestfield 25
TD5 7BX KELSO
Vereinigtes Königreich

Auf der Karte ansehen

Aktivitätstyp
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt Verwaltung
Martin Trevor Goosey (Dr.)
Links
Gesamtkosten
Keine Daten

Beteiligte (10)