Objective
advanced high density multilayer board technology: 2 layer fan-out capability > 500 I/O with 0.2 mm array component path, 50 um line width and spacing including microvias, integrated resistors and capacitors.
reworkable low cost assembly technology for flip chip and uBGA, using high melting metal bumps or elevated solderpads on the board side for flip chip and uBGA.
development of a digital telecom demonstrator for high volume telecom access circuits (frequency range up to 3GHz)
development of a RF analogue demonstrator operating in the frequency range 12,75-14,5 GHz.
further improvement of design tools and characterisation methods for process modelling, electrical modelling, thermomechanical modelling and devolpment of physical models and libraries tools for fine line printed circuit boards.
In Hiperprint a cost-effective modular, high volume, high frequency technology for printed subassemblies will be developed. The core of the technology is oriented towards advanced digital circuits operating at frequencies up to 622 Mbits/sec. The technology to be developed uses the latest improvements in cost-effective flip chip, uBGA and multilayer fine line technology. Assembly will cope with silicon ICs, GaAs MMICs and mixed assemblies (cfr. SMT components). The technology will be validated by means of high volume digital telecom circuits and high-end RF demonstrators. The project results will be made available to other users through the exploitation plans of the consortium partners.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
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Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
9000 Gent
Belgium
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.