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Towards Experimental Full Field Modal Analysis

Objective

The improvements in the electronics of modern cameras have raised the attention on image based technologies also for the measurement of complex vibration patterns for dynamic analyses in a broad extent beyond Holography. The advent of digital cameras has brought ESPI techniques to a recent success. Besides, the production of hi-speed digital cameras has recently raised DIC technique as another competitive technology in the full field domain; the SLDV,thanks to its ability to scan discrete locations over the surface,can also be considered close to the full field technologies.
Present dynamic testing and analysis approaches, based on traditional transducers, do not take full advantage of the growing optical measurements, while full field techniques have proved to be increasingly effective in complex dynamic analysis. This project aims at revisiting the procedures & algorithms in structural dynamics and at exploring the feasibility of new specific approaches for full field measurements. The activity will be deployed on:
-Comparison of full field technologies (ESPI,SLDV,DIC) for accurate spatial description in broad frequency ranges; dataset requirements, averaging and signal processing
-Use of full field FRFs with traditional approaches in dynamic analysis, NVH & EMA, with commercial & custom codes; evaluation of dynamic strain&stress measurements for fatigue predictions; rotational dofs FRFs; model updating
-Feasibility studies & implementation of new space domain based algorithms for Experimental Full Field Modal Analysis to exploit the spatial data redundancy in full field measurements
The results expected from this research will have a wide applicability and deep impact to strengthen the path of full field technologies in mechanical engineering and other fields, ranging from aerospace to vehicle technologies, electronic components, advanced material behaviour analysis.
The success of the project will be an important step in the scientific maturity for career growth

Field of science

  • /engineering and technology/electrical engineering, electronic engineering, information engineering/electronic engineering/sensors/optical sensors
  • /engineering and technology/electrical engineering, electronic engineering, information engineering/electronic engineering/signal processing
  • /engineering and technology/mechanical engineering

Call for proposal

FP7-PEOPLE-2011-IEF
See other projects for this call

Funding Scheme

MC-IEF - Intra-European Fellowships (IEF)

Coordinator

TECHNISCHE UNIVERSITAET WIEN
Address
Karlsplatz 13
1040 Wien
Austria
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 242 193,40
Administrative Contact
Johann Wassermann (Prof.)