Description du projet Core and disruptive photonic technologiesMIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D "optical engine".Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibres (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8” Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implemented for 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout. Afficher les objectifs du projet Masquer les objectifs du projet Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibrer (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8" Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implementedfor 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout. Champ scientifique engineering and technologymaterials engineeringfibersnatural sciencescomputer and information sciencesinternetnatural sciencesphysical sciencesopticsnatural scienceschemical sciencesinorganic chemistrymetalloids Programme(s) FP7-ICT - Specific Programme "Cooperation": Information and communication technologies Thème(s) ICT-2011.3.5 - Core and disruptive photonic technologies Appel à propositions FP7-ICT-2011-8 Voir d’autres projets de cet appel Régime de financement CP - Collaborative project (generic) Coordinateur EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON Contribution de l’UE € 447 398,00 Adresse PATISION 42 106 82 ATHINA Grèce Voir sur la carte Région Αττική Aττική Κεντρικός Τομέας Αθηνών Type d’activité Research Organisations Contact administratif Hercules Avramopoulos (Prof.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée Participants (7) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire AMS-OSRAM AG Autriche Contribution de l’UE € 380 189,00 Adresse TOBELBADERSTRASSE 30 SCHLOSS PREMSTATTEN 8141 UNTERPREMSTATTEN Voir sur la carte Région Südösterreich Steiermark Graz Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Contact administratif Yasmine Pree (Ms.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Belgique Contribution de l’UE € 639 322,00 Adresse KAPELDREEF 75 3001 Leuven Voir sur la carte Région Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Type d’activité Research Organisations Contact administratif Christine Van Houtven (Mrs.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH Allemagne Contribution de l’UE € 284 118,00 Adresse OTTO BLUMENTHAL STRASSE 52074 Aachen Voir sur la carte Région Nordrhein-Westfalen Köln Städteregion Aachen Type d’activité Other Contact administratif Anna Lena Giesecke (Dr.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée TECHNISCHE UNIVERSITAET MUENCHEN Allemagne Contribution de l’UE € 480 439,00 Adresse Arcisstrasse 21 80333 Muenchen Voir sur la carte Région Bayern Oberbayern München, Kreisfreie Stadt Type d’activité Higher or Secondary Education Establishments Contact administratif Katrin Hörmann (Ms.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée ARISTOTELIO PANEPISTIMIO THESSALONIKIS Grèce Contribution de l’UE € 323 260,00 Adresse KEDEA BUILDING, TRITIS SEPTEMVRIOU, ARISTOTLE UNIVERSITY CAMPUS 546 36 THESSALONIKI Voir sur la carte Région Βόρεια Ελλάδα Κεντρική Μακεδονία Θεσσαλονίκη Type d’activité Higher or Secondary Education Establishments Contact administratif Nikos Pleros (Prof.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée MELLANOX TECHNOLOGIES LTD - MLNX Israël Contribution de l’UE € 267 180,00 Adresse YOKNEAM ILIT INDUSTRIAL ZONE - HERMON BUILDING 20692 Yokneam Voir sur la carte Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Contact administratif Assaf Segal (Mr.) Liens Contacter l’organisation Opens in new window Site web Opens in new window Coût total Aucune donnée OPTOSCRIBE LIMITED Royaume-Uni Contribution de l’UE € 178 058,00 Adresse UNIT 1 ROSEBANK PARK ROSEBANK ROAD EH54 7EJ Livingston Voir sur la carte Région Scotland Eastern Scotland West Lothian Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Contact administratif Nicholas Psaila (Dr.) Liens Contacter l’organisation Opens in new window Coût total Aucune donnée