Objective The growing complexity of mobile communication and wireless devices has resulted in a growing and important requirement for low cost, low consumption and reduced size microelectronic and microsystem components in these products. This requires a high level of integration and poses significant challenges at all technology steps from materials through processing to packaging. The goal of CAMELIA (Monolithic Above IC Ultra High Value Capacitors for Mobile and Wireless Communication Systems) is to respond to this technology integration challenge in the specific area of capacitor technology. This is a critical area for future product innovation within the Information and Communications Technologies sector. For example, in a mobile phone, 80% of the surface is devoted to single passive components and especially capacitors.The main targeted application of CAMELIA is on-chip capacitors. By fabricating thin-film capacitors on-chip, one gains not only high-frequency decoupling capacitors, but also space saving, and significant improvements in performance over discrete chip capacitors. CAMELIA addresses the above challenge of manufacturing a thin film, high capacitance, above chip (hence low temperature) capacitor component by developing a novel low-cost ferroelectric multi-component oxide based materials science and processing technology, enabling the integration of decoupling capacitors with a very small form factor in an above-IC strategy for System on Chip and wireless microsystems.The overall aim of CAMELIA is to research and develop a novel low temperature (#lt;400oC) high k (above 2000) dielectric material and processing technology for future high density or ultra low profile MIM (Metal/Insulator/Metal) decoupling capacitor applications. To the best of our knowledge, this has not been demonstrated to-date. Fields of science engineering and technologynanotechnologynano-materialsnanocrystalsengineering and technologymaterials engineeringcoating and filmsengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsmobile phonesengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyengineering and technologymaterials engineeringceramics Programme(s) FP6-NMP - Nanotechnologies and nanosciences, knowledge-based multifunctional materials and new production processes and devices: thematic priority 3 under the 'Focusing and integrating community research' of the 'Integrating and strengthening the European Research Area' specific programme 2002-2006. Topic(s) NMP-2004-3.4.2.2-3 - Multifunctional ceramic thin films with radically new properties Call for proposal FP6-2004-NMP-TI-4 See other projects for this call Funding Scheme STREP - Specific Targeted Research Project Coordinator UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK Address College road, Cork Ireland See on map Links Website Opens in new window EU contribution € 0,00 Participants (4) Sort alphabetically Sort by EU Contribution Expand all Collapse all 3D PLUS France EU contribution € 0,00 Address 641 rue helene boucher Buc See on map Links Website Opens in new window COMMISSARIAT A L' ENERGIE ATOMIQUE' France EU contribution € 0,00 Address 31-33 rue de la federation Paris See on map Links Website Opens in new window ELA MEDICAL SAS France EU contribution € 0,00 Address 98 - 100 rue maurice arnoux Montrouge See on map Links Website Opens in new window INSTITUT JOZEF STEFAN Slovenia EU contribution € 0,00 Address Jamova 39 Ljubljana See on map Links Website Opens in new window
