Obiettivo The growing complexity of mobile communication and wireless devices has resulted in a growing and important requirement for low cost, low consumption and reduced size microelectronic and microsystem components in these products. This requires a high level of integration and poses significant challenges at all technology steps from materials through processing to packaging. The goal of CAMELIA (Monolithic Above IC Ultra High Value Capacitors for Mobile and Wireless Communication Systems) is to respond to this technology integration challenge in the specific area of capacitor technology. This is a critical area for future product innovation within the Information and Communications Technologies sector. For example, in a mobile phone, 80% of the surface is devoted to single passive components and especially capacitors.The main targeted application of CAMELIA is on-chip capacitors. By fabricating thin-film capacitors on-chip, one gains not only high-frequency decoupling capacitors, but also space saving, and significant improvements in performance over discrete chip capacitors. CAMELIA addresses the above challenge of manufacturing a thin film, high capacitance, above chip (hence low temperature) capacitor component by developing a novel low-cost ferroelectric multi-component oxide based materials science and processing technology, enabling the integration of decoupling capacitors with a very small form factor in an above-IC strategy for System on Chip and wireless microsystems.The overall aim of CAMELIA is to research and develop a novel low temperature (#lt;400oC) high k (above 2000) dielectric material and processing technology for future high density or ultra low profile MIM (Metal/Insulator/Metal) decoupling capacitor applications. To the best of our knowledge, this has not been demonstrated to-date. Campo scientifico ingegneria e tecnologiananotecnologiananomaterialinanocristalliingegneria e tecnologiaingegneria dei materialirivestimenti e pellicoleingegneria e tecnologiaingegneria elettrica, ingegneria elettronica, ingegneria informaticaingegneria informaticatelecomunicazionitelefoni mobiliingegneria e tecnologiaingegneria elettrica, ingegneria elettronica, ingegneria informaticaingegneria informaticatelecomunicazionitecnologia radioingegneria e tecnologiaingegneria dei materialiceramica Programma(i) FP6-NMP - Nanotechnologies and nanosciences, knowledge-based multifunctional materials and new production processes and devices: thematic priority 3 under the 'Focusing and integrating community research' of the 'Integrating and strengthening the European Research Area' specific programme 2002-2006. Argomento(i) NMP-2004-3.4.2.2-3 - Multifunctional ceramic thin films with radically new properties Invito a presentare proposte FP6-2004-NMP-TI-4 Vedi altri progetti per questo bando Meccanismo di finanziamento STREP - Specific Targeted Research Project Coordinatore UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK Indirizzo College road, Cork Irlanda Mostra sulla mappa Collegamenti Sito web Opens in new window Contributo UE Nessun dato Partecipanti (4) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto 3D PLUS Francia Contributo UE € 0,00 Indirizzo 641 rue helene boucher Buc Mostra sulla mappa Collegamenti Sito web Opens in new window Altri finanziamenti Nessun dato COMMISSARIAT A L' ENERGIE ATOMIQUE' Francia Contributo UE € 0,00 Indirizzo 31-33 rue de la federation Paris Mostra sulla mappa Collegamenti Sito web Opens in new window Altri finanziamenti Nessun dato ELA MEDICAL SAS Francia Contributo UE € 0,00 Indirizzo 98 - 100 rue maurice arnoux Montrouge Mostra sulla mappa Collegamenti Sito web Opens in new window Altri finanziamenti Nessun dato INSTITUT JOZEF STEFAN Slovenia Contributo UE € 0,00 Indirizzo Jamova 39 Ljubljana Mostra sulla mappa Collegamenti Sito web Opens in new window Altri finanziamenti Nessun dato
