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A System Supporting ASIC Design and Providing Rapid Turnaround Prototyping

Objective

The overall objective of QUICKCHIPS is to make available to industry in general, and to SMEs in particular, powerful new technologies and commercial structures supporting the design of ASICs and offering low-cost rapid turnaround prototyping.
Project activities include:
development of a set of computer aided design (CAD) tools based on commercially available software integrated into a powerful framework, supporting selective access to multiple foundries;
enhancement of a direct write laser system to support foundry technologies needed for the mask free production of gate arrays;
creation and optimization of back end wafer fabrication and finishing capability for multilevel interconnect metallization;
establishment and phased build up of a telecommunications network serving the needs of geographically dispersed QCC operations.

Design tools and a basic library of uncommitted logic have been integrated into a framework with technology with dependent output. A multilevel metallization process using a direct write laser lithography system has been installed at 2 partner sites. Studies of data communication options have shown that very small aperture satellite communications implementations are feasible and cost effective for geographically dispersed design centres. Demonstrator application specific integrated circuits (ASICs) in the project based Markov random field formulations represent useful advanced in real time image processing.
This project is the application phase of work conducted in project 5047.

The project consists of closely related activities in the areas of CAD, laser lithography equipment, interconnect process technology and telecommunications. In order to ensure the exploitation of results, the partners will be participating in the formation of a commercial organisation, the QCC Quickchips consortium, which aims to offer ASIC development support, prototyping and semiconductor brokerage services exploiting the new technologies developed in the project.

Project activities include:

- Development of a set of CAD tools based on commercially available software integrated into a powerful framework, supporting selective access to multiple foundries.
- Enhancement of a direct-write laser system to support foundry technologies needed for the mask-free production of gate arrays.
- Creation and optimisation of back-end wafer fabrication and finishing capability for multi-level interconnect metallisation.
- Establishment and phased build-up of a telecommunications network serving the needs of geographically dispersed QCC operations.

Coordinator

INSTITUTO DE ENGENHARIA DE SISTEMAS E COMPUTADORES
Address
Apartado 10105, Rua Alves Redol, 9
1017 Lisboa
Portugal

Participants (8)

CPRM/COMPANHIA PORTUGUESA RADIO MARCONI SA
Portugal
Address
Av.duque De Loule,, 97
1000 Lisboa
HEIDELBERG INSTRUMENTS MIKROTECHNIK
Germany
Address
Im Neuenheimer Feld 518
69120 Heidelberg
INTERUNIVERSITAIR MIKROELEKTRONICA CENTRUM
Belgium
Address
Kapeldreef, 75
3030 Heverlee
INTRACOM SA-HELLENIC TELECOM.& ELECTR.INDUSTRY
Greece
Address
19.5 Km Markopoulou Avenue, 68, 68
19002 Peania - Attika
Institut für Mikroelektronik Stuttgart
Germany
Address
Allmandring 30A
70569 Stuttgart
LASARRAY HOLDING
Switzerland
Address
Thurgan
8512 Thundorf
Siemens AG
Germany
Address
Otto-hahn-ring 6
81739 München
UNIVERSITY OF PATRAS
Greece
Address

26500 Patras