Transfer-print operations for heterogeneous integration

Informations projet

TOP HIT

N° de convention de subvention: 645314

DOI

10.3030/645314

Projet clôturé

Date de signature de la CE 18 Decembre 2014

Date de début 2 Février 2015

Date de fin 1 Août 2018

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total

€ 5 252 637,75

Contribution de l’UE

€ 5 252 637,75

Coordonné par

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Documents, reports (2)

Plan for access to technology

During the second phase a business plan will be drawn up to explore the different options by which the technology can be made widely available through foundry-like processes. This report will address the supply of transferrable components, the foundries to perform the transfer print and the foundries to perform the interconnections and device singulation. The wafer size (75mm-200mm) and compatibility (eg Au, topography issues) of the needed processes will be addressed.

Newsletter

A newsletter explaining and promoting and TOP HIT technology and its objectives will written and circulated to all interested parties.

Publications

Peer reviewed articles (12)

Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices

Auteurs: J. O’Callaghan, R. Loi, E. E. Mura, B. Roycroft, A. J. Trindade, K. Thomas, A. Gocalinska, E. Pelucchi, J. Zhang, G. Roelkens, C. A. Bower, B. Corbett
Publié dans: Optical Materials Express, Numéro 7/12, 2017, Page(s) 4408, ISSN 2159-3930
Éditeur: Optical Society of America
DOI: 10.1364/ome.7.004408

High-alignment-accuracy transfer printing of passive silicon waveguide structures

Auteurs: Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, Gunther Roelkens
Publié dans: Optics Express, Numéro 26/2, 2018, Page(s) 2023, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/oe.26.002023

Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs

Auteurs: Nan Ye, Grigorij Muliuk, Jing Zhang, Amin Abbasi, Antonio Jose Trindade, Chris Bower, Dries Van Thourhout, Gunther Roelkens
Publié dans: Journal of Lightwave Technology, Numéro 36/5, 2018, Page(s) 1249-1254, ISSN 0733-8724
Éditeur: Optical Society of America
DOI: 10.1109/JLT.2017.2777509

Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser

Auteurs: Jing Zhang, Bahawal Haq, James O’Callaghan, Angieska Gocalinska, Emanuele Pelucchi, António José Trindade, Brian Corbett, Geert Morthier, Gunther Roelkens
Publié dans: Optics Express, Numéro 26/7, 2018, Page(s) 8821, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/OE.26.008821

Integration of etched facet, electrically pumped, C-band Fabry-Perot lasers on a silicon photonic integrated circuit by transfer printing

Auteurs: Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas De Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Gunther Roelkens and Dries Van Thourhout,
Publié dans: Optics Express, Numéro 26(17), 2018, Page(s) 21443 and following, ISSN 1094-4087
Éditeur: Optical Society of America

Thermal Analysis of InP Lasers Transfer-printed to Silicon Photonics Substrates

Auteurs: Ruggero Loi, James O'Callaghan, Brendan Roycroft, Zhiheng Quan, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Antonio Jose Trindade, Chris Anthony Bower, Brian Corbett
Publié dans: Journal of Lightwave Technology, 2018, Page(s) 1-1, ISSN 0733-8724
Éditeur: Optical Society of America
DOI: 10.1109/JLT.2018.2881179

Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates

Auteurs: Ruggero Loi, James O'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett
Publié dans: IEEE Photonics Journal, Numéro 8/6, 2016, Page(s) 1-10, ISSN 1943-0655
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/JPHOT.2016.2627883

Unidirectional, widely-tunable and narrow-linewidth heterogeneously integrated III-V-on-silicon laser

Auteurs: Jing Zhang, Yanlu Li, Sören Dhoore, Geert Morthier, Gunther Roelkens
Publié dans: Optics Express, Numéro 25/6, 2017, Page(s) 7092, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/OE.25.007092

Novel adiabatic tapered couplers for active III–V/SOI devices fabricated through transfer printing

Auteurs: Sören Dhoore, Sarah Uvin, Dries Van Thourhout, Geert Morthier, and Gunther Roelkens
Publié dans: Optics Express, Numéro 24 (12), 2016, Page(s) 12976-12990, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/OE.24.012976

Transfer print techniques for heterogeneous integration of photonic components

Auteurs: Brian Corbett, Ruggero Loi, Weidong Zhou, Dong Liu, Zhenqiang Ma
Publié dans: Progress in Quantum Electronics, Numéro 52, 2017, Page(s) 1-17, ISSN 0079-6727
Éditeur: Pergamon Press
DOI: 10.1016/j.pquantelec.2017.01.001

Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors

Auteurs: Jing Zhang, Andreas De Groote, Amin Abbasi, Ruggero Loi, James O’Callaghan, Brian Corbett, António José Trindade, Christopher A. Bower, Gunther Roelkens
Publié dans: Optics Express, Numéro 25/13, 2017, Page(s) 14290, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/OE.25.014290

Transfer Printing of Micron-Size Graphene for Photonic Integrated Circuits and Devices

Auteurs: Leili Abdollahi Shiramin, Alexandre Bazin, Steven Verstuyft, Sylvia Lycke, Peter Vandenabeele, Gunther Roelkens, Dries Van Thourhout
Publié dans: ECS Journal of Solid State Science and Technology, Numéro 6/7, 2017, Page(s) P435-P439, ISSN 2162-8769
Éditeur: Electrochemical Society, Inc.
DOI: 10.1149/2.0241707jss

Conference proceedings (4)

Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs

Auteurs: G. Muliuk, N. Ye, J. Zhang, A. Abbasi, D. Van Thourhout, G. Roelkens
Publié dans: European Conference on Optical Communication, Sweden, p.PDP.C.4 (2017)., 2017
Éditeur: --

"4x25Gbit/s Silicon Photonics Tunable Receiver using Transfer Printed III-V Photodiodes"","

Auteurs: G. Muliuk, K. Van Gasse, M. Shahin, J. Verbist, A.J. Trindade, B. Corbett, D. Van Thourhout, G. Roelkens
Publié dans: IEEE Photonics Conference, Reston, VA, USA, 2018
Éditeur: IEEE

Transferred III-V Materials - Novel Devices and Integration

Auteurs: B. Corbett, R. Loi, D. Quinn, J. O’Callaghan, N. Liu
Publié dans: Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS), 2017, Page(s) ITu2A.4, ISBN 978-1-943580-30-9
Éditeur: OSA
DOI: 10.1364/IPRSN.2017.ITu2A.4

"""Transfer printing of silicon-on-insulator devices on silicon nitride waveguide circuits: design of coupling structures and process development."""

Auteurs: Muliuk, Grigorij, et al.
Publié dans: Proceedings Symposium IEEE Photonics Society Benelux. 2016., 2016
Éditeur: IEEE

Book chapters (1)

Transfer Printing for Silicon Photonics

Auteurs: Brian Corbett, Ruggero Loi, James O’Callaghan,and Gunther Roelkens
Publié dans: Semiconductors and Semimetals, Numéro Volume 99 (Silicon Photonics), 2018, Page(s) 43-70, ISSN 0080-8784
Éditeur: Elsevier Inc.
DOI: 10.1016/bs.semsem.2018.08.001

Non-peer reviewed articles (1)

III-V-on-silicon integration

Auteurs: D. Van Thourhout, Z. Wang, G. Roelkens
Publié dans: Optics & Photonics News, Numéro 3/2017, 2017, Page(s) p.34-39
Éditeur: OSA