Transfer-print operations for heterogeneous integration

Información del proyecto

TOP HIT

Identificador del acuerdo de subvención: 645314

DOI

10.3030/645314

Proyecto cerrado

Fecha de la firma de la CE 18 Diciembre 2014

Fecha de inicio 2 Febrero 2015

Fecha de finalización 1 Agosto 2018

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total

€ 5 252 637,75

Aportación de la UE

€ 5 252 637,75

Coordinado por

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (2)

Plan for access to technology

During the second phase a business plan will be drawn up to explore the different options by which the technology can be made widely available through foundry-like processes. This report will address the supply of transferrable components, the foundries to perform the transfer print and the foundries to perform the interconnections and device singulation. The wafer size (75mm-200mm) and compatibility (eg Au, topography issues) of the needed processes will be addressed.

Newsletter

A newsletter explaining and promoting and TOP HIT technology and its objectives will written and circulated to all interested parties.

Publicaciones

Peer reviewed articles (12)

Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices

Autores: J. O’Callaghan, R. Loi, E. E. Mura, B. Roycroft, A. J. Trindade, K. Thomas, A. Gocalinska, E. Pelucchi, J. Zhang, G. Roelkens, C. A. Bower, B. Corbett
Publicado en: Optical Materials Express, Edición 7/12, 2017, Página(s) 4408, ISSN 2159-3930
Editor: Optical Society of America
DOI: 10.1364/ome.7.004408

High-alignment-accuracy transfer printing of passive silicon waveguide structures

Autores: Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, Gunther Roelkens
Publicado en: Optics Express, Edición 26/2, 2018, Página(s) 2023, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.26.002023

Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs

Autores: Nan Ye, Grigorij Muliuk, Jing Zhang, Amin Abbasi, Antonio Jose Trindade, Chris Bower, Dries Van Thourhout, Gunther Roelkens
Publicado en: Journal of Lightwave Technology, Edición 36/5, 2018, Página(s) 1249-1254, ISSN 0733-8724
Editor: Optical Society of America
DOI: 10.1109/JLT.2017.2777509

Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser

Autores: Jing Zhang, Bahawal Haq, James O’Callaghan, Angieska Gocalinska, Emanuele Pelucchi, António José Trindade, Brian Corbett, Geert Morthier, Gunther Roelkens
Publicado en: Optics Express, Edición 26/7, 2018, Página(s) 8821, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/OE.26.008821

Integration of etched facet, electrically pumped, C-band Fabry-Perot lasers on a silicon photonic integrated circuit by transfer printing

Autores: Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas De Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Gunther Roelkens and Dries Van Thourhout,
Publicado en: Optics Express, Edición 26(17), 2018, Página(s) 21443 and following, ISSN 1094-4087
Editor: Optical Society of America

Thermal Analysis of InP Lasers Transfer-printed to Silicon Photonics Substrates

Autores: Ruggero Loi, James O'Callaghan, Brendan Roycroft, Zhiheng Quan, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Antonio Jose Trindade, Chris Anthony Bower, Brian Corbett
Publicado en: Journal of Lightwave Technology, 2018, Página(s) 1-1, ISSN 0733-8724
Editor: Optical Society of America
DOI: 10.1109/JLT.2018.2881179

Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates

Autores: Ruggero Loi, James O'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett
Publicado en: IEEE Photonics Journal, Edición 8/6, 2016, Página(s) 1-10, ISSN 1943-0655
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/JPHOT.2016.2627883

Unidirectional, widely-tunable and narrow-linewidth heterogeneously integrated III-V-on-silicon laser

Autores: Jing Zhang, Yanlu Li, Sören Dhoore, Geert Morthier, Gunther Roelkens
Publicado en: Optics Express, Edición 25/6, 2017, Página(s) 7092, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/OE.25.007092

Novel adiabatic tapered couplers for active III–V/SOI devices fabricated through transfer printing

Autores: Sören Dhoore, Sarah Uvin, Dries Van Thourhout, Geert Morthier, and Gunther Roelkens
Publicado en: Optics Express, Edición 24 (12), 2016, Página(s) 12976-12990, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/OE.24.012976

Transfer print techniques for heterogeneous integration of photonic components

Autores: Brian Corbett, Ruggero Loi, Weidong Zhou, Dong Liu, Zhenqiang Ma
Publicado en: Progress in Quantum Electronics, Edición 52, 2017, Página(s) 1-17, ISSN 0079-6727
Editor: Pergamon Press
DOI: 10.1016/j.pquantelec.2017.01.001

Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors

Autores: Jing Zhang, Andreas De Groote, Amin Abbasi, Ruggero Loi, James O’Callaghan, Brian Corbett, António José Trindade, Christopher A. Bower, Gunther Roelkens
Publicado en: Optics Express, Edición 25/13, 2017, Página(s) 14290, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/OE.25.014290

Transfer Printing of Micron-Size Graphene for Photonic Integrated Circuits and Devices

Autores: Leili Abdollahi Shiramin, Alexandre Bazin, Steven Verstuyft, Sylvia Lycke, Peter Vandenabeele, Gunther Roelkens, Dries Van Thourhout
Publicado en: ECS Journal of Solid State Science and Technology, Edición 6/7, 2017, Página(s) P435-P439, ISSN 2162-8769
Editor: Electrochemical Society, Inc.
DOI: 10.1149/2.0241707jss

Conference proceedings (4)

Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs

Autores: G. Muliuk, N. Ye, J. Zhang, A. Abbasi, D. Van Thourhout, G. Roelkens
Publicado en: European Conference on Optical Communication, Sweden, p.PDP.C.4 (2017)., 2017
Editor: --

"4x25Gbit/s Silicon Photonics Tunable Receiver using Transfer Printed III-V Photodiodes"","

Autores: G. Muliuk, K. Van Gasse, M. Shahin, J. Verbist, A.J. Trindade, B. Corbett, D. Van Thourhout, G. Roelkens
Publicado en: IEEE Photonics Conference, Reston, VA, USA, 2018
Editor: IEEE

Transferred III-V Materials - Novel Devices and Integration

Autores: B. Corbett, R. Loi, D. Quinn, J. O’Callaghan, N. Liu
Publicado en: Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS), 2017, Página(s) ITu2A.4, ISBN 978-1-943580-30-9
Editor: OSA
DOI: 10.1364/IPRSN.2017.ITu2A.4

"""Transfer printing of silicon-on-insulator devices on silicon nitride waveguide circuits: design of coupling structures and process development."""

Autores: Muliuk, Grigorij, et al.
Publicado en: Proceedings Symposium IEEE Photonics Society Benelux. 2016., 2016
Editor: IEEE

Book chapters (1)

Transfer Printing for Silicon Photonics

Autores: Brian Corbett, Ruggero Loi, James O’Callaghan,and Gunther Roelkens
Publicado en: Semiconductors and Semimetals, Edición Volume 99 (Silicon Photonics), 2018, Página(s) 43-70, ISSN 0080-8784
Editor: Elsevier Inc.
DOI: 10.1016/bs.semsem.2018.08.001

Non-peer reviewed articles (1)

III-V-on-silicon integration

Autores: D. Van Thourhout, Z. Wang, G. Roelkens
Publicado en: Optics & Photonics News, Edición 3/2017, 2017, Página(s) p.34-39
Editor: OSA