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Transfer-print operations for heterogeneous integration

Deliverables

Plan for access to technology

During the second phase a business plan will be drawn up to explore the different options by which the technology can be made widely available through foundry-like processes. This report will address the supply of transferrable components, the foundries to perform the transfer print and the foundries to perform the interconnections and device singulation. The wafer size (75mm-200mm) and compatibility (eg Au, topography issues) of the needed processes will be addressed.

Newsletter

A newsletter explaining and promoting and TOP HIT technology and its objectives will written and circulated to all interested parties.

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Publications

Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices

Author(s): J. O’Callaghan, R. Loi, E. E. Mura, B. Roycroft, A. J. Trindade, K. Thomas, A. Gocalinska, E. Pelucchi, J. Zhang, G. Roelkens, C. A. Bower, B. Corbett
Published in: Optical Materials Express, Issue 7/12, 2017, Page(s) 4408, ISSN 2159-3930
DOI: 10.1364/ome.7.004408

High-alignment-accuracy transfer printing of passive silicon waveguide structures

Author(s): Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, Gunther Roelkens
Published in: Optics Express, Issue 26/2, 2018, Page(s) 2023, ISSN 1094-4087
DOI: 10.1364/oe.26.002023

Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs

Author(s): Nan Ye, Grigorij Muliuk, Jing Zhang, Amin Abbasi, Antonio Jose Trindade, Chris Bower, Dries Van Thourhout, Gunther Roelkens
Published in: Journal of Lightwave Technology, Issue 36/5, 2018, Page(s) 1249-1254, ISSN 0733-8724
DOI: 10.1109/JLT.2017.2777509

Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser

Author(s): Jing Zhang, Bahawal Haq, James O’Callaghan, Angieska Gocalinska, Emanuele Pelucchi, António José Trindade, Brian Corbett, Geert Morthier, Gunther Roelkens
Published in: Optics Express, Issue 26/7, 2018, Page(s) 8821, ISSN 1094-4087
DOI: 10.1364/OE.26.008821

Integration of etched facet, electrically pumped, C-band Fabry-Perot lasers on a silicon photonic integrated circuit by transfer printing

Author(s): Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas De Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Gunther Roelkens and Dries Van Thourhout,
Published in: Optics Express, Issue 26(17), 2018, Page(s) 21443 and following, ISSN 1094-4087

Thermal Analysis of InP Lasers Transfer-printed to Silicon Photonics Substrates

Author(s): Ruggero Loi, James O'Callaghan, Brendan Roycroft, Zhiheng Quan, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Antonio Jose Trindade, Chris Anthony Bower, Brian Corbett
Published in: Journal of Lightwave Technology, 2018, Page(s) 1-1, ISSN 0733-8724
DOI: 10.1109/JLT.2018.2881179

Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates

Author(s): Ruggero Loi, James O'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett
Published in: IEEE Photonics Journal, Issue 8/6, 2016, Page(s) 1-10, ISSN 1943-0655
DOI: 10.1109/JPHOT.2016.2627883

Unidirectional, widely-tunable and narrow-linewidth heterogeneously integrated III-V-on-silicon laser

Author(s): Jing Zhang, Yanlu Li, Sören Dhoore, Geert Morthier, Gunther Roelkens
Published in: Optics Express, Issue 25/6, 2017, Page(s) 7092, ISSN 1094-4087
DOI: 10.1364/OE.25.007092

Novel adiabatic tapered couplers for active III–V/SOI devices fabricated through transfer printing

Author(s): Sören Dhoore, Sarah Uvin, Dries Van Thourhout, Geert Morthier, and Gunther Roelkens
Published in: Optics Express, Issue 24 (12), 2016, Page(s) 12976-12990, ISSN 1094-4087
DOI: 10.1364/OE.24.012976

Transfer print techniques for heterogeneous integration of photonic components

Author(s): Brian Corbett, Ruggero Loi, Weidong Zhou, Dong Liu, Zhenqiang Ma
Published in: Progress in Quantum Electronics, Issue 52, 2017, Page(s) 1-17, ISSN 0079-6727
DOI: 10.1016/j.pquantelec.2017.01.001

Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors

Author(s): Jing Zhang, Andreas De Groote, Amin Abbasi, Ruggero Loi, James O’Callaghan, Brian Corbett, António José Trindade, Christopher A. Bower, Gunther Roelkens
Published in: Optics Express, Issue 25/13, 2017, Page(s) 14290, ISSN 1094-4087
DOI: 10.1364/OE.25.014290

Transfer Printing of Micron-Size Graphene for Photonic Integrated Circuits and Devices

Author(s): Leili Abdollahi Shiramin, Alexandre Bazin, Steven Verstuyft, Sylvia Lycke, Peter Vandenabeele, Gunther Roelkens, Dries Van Thourhout
Published in: ECS Journal of Solid State Science and Technology, Issue 6/7, 2017, Page(s) P435-P439, ISSN 2162-8769
DOI: 10.1149/2.0241707jss

Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs

Author(s): G. Muliuk, N. Ye, J. Zhang, A. Abbasi, D. Van Thourhout, G. Roelkens
Published in: European Conference on Optical Communication, Sweden, p.PDP.C.4 (2017)., 2017

"4x25Gbit/s Silicon Photonics Tunable Receiver using Transfer Printed III-V Photodiodes"","

Author(s): G. Muliuk, K. Van Gasse, M. Shahin, J. Verbist, A.J. Trindade, B. Corbett, D. Van Thourhout, G. Roelkens
Published in: IEEE Photonics Conference, Reston, VA, USA, 2018

Transferred III-V Materials - Novel Devices and Integration

Author(s): B. Corbett, R. Loi, D. Quinn, J. O’Callaghan, N. Liu
Published in: Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS), 2017, Page(s) ITu2A.4
DOI: 10.1364/IPRSN.2017.ITu2A.4

"""Transfer printing of silicon-on-insulator devices on silicon nitride waveguide circuits: design of coupling structures and process development."""

Author(s): Muliuk, Grigorij, et al.
Published in: Proceedings Symposium IEEE Photonics Society Benelux. 2016., 2016

Transfer Printing for Silicon Photonics

Author(s): Brian Corbett, Ruggero Loi, James O’Callaghan,and Gunther Roelkens
Published in: Semiconductors and Semimetals, Issue Volume 99 (Silicon Photonics), 2018, Page(s) 43-70, ISSN 0080-8784

III-V-on-silicon integration