Hybrid Ultra Flexible Printed Circuits combining flexible and low-cost printed electronics with high performance traditional silicon components.

Project Information

UFPC Technology

Grant agreement ID: 683725

DOI

10.3030/683725

Project closed

EC signature date 12 June 2015

Start date 1 July 2015

End date 31 October 2015

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies

Total cost

€ 71 429,00

EU contribution

€ 50 000,00

Coordinated by

VIVA DEVELOPMENTS SL
Spain

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