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CORDIS - Resultados de investigaciones de la UE
CORDIS

NanoElectronics Roadmap for Europe: Identification and Dissemination

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Set up the NEREID Advisory Committee (se abrirá en una nueva ventana)

First list of experts for the Advisory Board with special regards to international roadmap activities.

Web site available online (se abrirá en una nueva ventana)

Availability of the project web site, including a public area.

Final communication event (se abrirá en una nueva ventana)

Final public event for the dissemination of the roadmap, possibly coupled to another major European event for Nanoelectronics.

Input to the Roadmap in the form of a Chapter for Beyond CMOS (se abrirá en una nueva ventana)

Contribution by WP2 to the preparation of the final roadmap.

Roadmap priorities from 1st General Workshop with applications (se abrirá en una nueva ventana)

Report on the outcome of the 1st General Workshop with Applications companies, with indications on the priorities for technology development.

Input to the Roadmap in the form of a Chapter for Functional Diversification (se abrirá en una nueva ventana)

Contribution of WP4 to the final roadmap

Technology Outlook in Nanoelectronics and harmonization of NEREID roadmaps with International Roadmaps. (se abrirá en una nueva ventana)

Report on the international Outlook of Nanoelectronics Technology, and guidelines for harmonization of NEREID roadmap.

European Technology Outlook (ETO) report (se abrirá en una nueva ventana)

Preparation of a European Technology Outlook for Nanoelectronics, with summaries written in non-technical language. This document will be provided to the parliamentary Science Commissions in the countries of the Consortium.

Input to the Roadmap in the form of a Chapter for equipment and manufacturing science (se abrirá en una nueva ventana)

Contribution of WP6 to the final roadmap.

First roadmap release communication (se abrirá en una nueva ventana)

First release of the roadmap with publication and participation to events.

Dissemination, Communication and Data Management Plan update (se abrirá en una nueva ventana)

Update and 2nd release of the communication and dissemination plan for the roadmap.

Mapping of International Roadmap Activities (se abrirá en una nueva ventana)

List and description of international roadmap activities to which links need to be established by NEREID

Dissemination, Communication and Data Management Plan (se abrirá en una nueva ventana)

1st release of the communication and dissemination plan for the project.

Report on General Workshop 1 and its impact on system integration, and case studies for Domain Workshops (se abrirá en una nueva ventana)

Report on the results of the 1st general workshop and its impact on system integration. Definition of case studies for WP5 specific workshops.

Input to the Roadmap in the form of a Chapter for data processing and transmission. (se abrirá en una nueva ventana)

Contribution by WP3 to the final roadmap.

Final report (se abrirá en una nueva ventana)

Final project report according to Commission rules, including a publishable section.

Input to the Roadmap in the form of a Chapter for System Design and Heterogeneous Integration (se abrirá en una nueva ventana)

Contribution of WP5 to the final roadmap.

Final release of roadmap (se abrirá en una nueva ventana)

Final release of the roadmap for the Commission and internal use

Publicaciones

Advanced sensor systems by low-temperature heterogeneous 3D integration processes (se abrirá en una nueva ventana)

Autores: Montserrat Fernandez-Bolanos, Andrei Muller, Josef Weber, Peter Ramm
Publicado en: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018, Página(s) 1-5, ISBN 978-1-5386-6199-4
Editor: IEEE
DOI: 10.1109/DTIP.2018.8394203

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