Objective
The interest for developing smart systems based on interconnected objects is growing fast (50 billion objects connected in 2020). The main components of “Internet of Things” (IoT) devices are autonomous battery-operated smart embedded systems comprising communication circuits, sensors, computing/processing devices and storage. The key requirements are ultra-low power, high processing capabilities, fast/dense storage, wireless communication, heterogeneous integration, and autonomy. The different functions are so far implemented in separate chips/technologies, which is a bottleneck in terms of costs and miniaturization. To tackle the key issues of monolithic heterogeneous integration, fast yet low power processing, high integration density, fast yet low power storage, the goal of the GREAT STREP project is to co-integrate multiple functions like sensors (“Sensing”), RF receivers (“Communicating”) and logic/memory (“Processing/Storing”) together within CMOS by adapting the STT-MTJs (Magnetic devices) to a single baseline technology. This lead to a unique STT-MTJ cell technology called Multifunctional Standardized (MTJ) Stack (MSS), paving the way to 2.5D self-integrated heterogeneous architectures . The major outputs of GREAT are the technology and the architecture platform for IoT SoCs which provides better integration of embedded & mobile communication systems and a significant decrease of their power consumption. Based on the STT unique set of performances (non-volatility, high speed, infinite endurance and moderate read/write power), GREAT will achieve the same goal as heterogeneous integration of devices but in a much simpler way. The project final objectives are: fabrication of an advanced MSS technology test chip jointly with a system-level simulation and design of a representative M2M IoT platform integrating MSS. The consortium is composed of 9 EU partners led by CEA and of an Advisory Board comprising leaders in IP solutions, IoT, and mobile technologies.
Field of science
- /natural sciences/computer and information sciences/data science/data processing
- /engineering and technology/electrical engineering, electronic engineering, information engineering/electronic engineering/analogue electronics
- /engineering and technology/electrical engineering, electronic engineering, information engineering/electronic engineering/sensors
- /natural sciences/computer and information sciences/internet/internet of things
- /medical and health sciences/medical biotechnology/cells technologies
Call for proposal
H2020-ICT-2015
See other projects for this call
Funding Scheme
RIA - Research and Innovation actionCoordinator
75015 Paris 15
France
Participants (8)
76131 Karlsruhe
75794 Paris
500036 Brasov
01069 Dresden
63796 Kahl Am Main
23105 Migdal Haemek
Participation ended
38040 Grenoble
83500 La Seyne Sur Mer
