Objective
The interest for developing smart systems based on interconnected objects is growing fast (50 billion objects connected in 2020). The main components of “Internet of Things” (IoT) devices are autonomous battery-operated smart embedded systems comprising communication circuits, sensors, computing/processing devices and storage. The key requirements are ultra-low power, high processing capabilities, fast/dense storage, wireless communication, heterogeneous integration, and autonomy. The different functions are so far implemented in separate chips/technologies, which is a bottleneck in terms of costs and miniaturization. To tackle the key issues of monolithic heterogeneous integration, fast yet low power processing, high integration density, fast yet low power storage, the goal of the GREAT STREP project is to co-integrate multiple functions like sensors (“Sensing”), RF receivers (“Communicating”) and logic/memory (“Processing/Storing”) together within CMOS by adapting the STT-MTJs (Magnetic devices) to a single baseline technology. This lead to a unique STT-MTJ cell technology called Multifunctional Standardized (MTJ) Stack (MSS), paving the way to 2.5D self-integrated heterogeneous architectures . The major outputs of GREAT are the technology and the architecture platform for IoT SoCs which provides better integration of embedded & mobile communication systems and a significant decrease of their power consumption. Based on the STT unique set of performances (non-volatility, high speed, infinite endurance and moderate read/write power), GREAT will achieve the same goal as heterogeneous integration of devices but in a much simpler way. The project final objectives are: fabrication of an advanced MSS technology test chip jointly with a system-level simulation and design of a representative M2M IoT platform integrating MSS. The consortium is composed of 9 EU partners led by CEA and of an Advisory Board comprising leaders in IP solutions, IoT, and mobile technologies.
Fields of science
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsbiosensors
- natural sciencescomputer and information sciencesinternetinternet of things
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensors
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringanalogue electronics
- medical and health sciencesmedical biotechnologycells technologies
Programme(s)
Funding Scheme
RIA - Research and Innovation action
Coordinator
75015 Paris 15
France
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Participants (9)
76131 Karlsruhe
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75794 Paris
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
34090 Montpellier
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500036 Brasov
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01069 Dresden
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63796 Kahl Am Main
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23105 Migdal Haemek
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Participation ended
38040 Grenoble
83500 La Seyne Sur Mer
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.