Deliverables
This first model, written in VerilogA to be compatible with all the standard electrical simulators, will take into account the main physical effects required to model the logic, memory, analog and RF functionalities. At this stage, the model will remain relatively generic and will be tuned later according to the progress of the technology.
Consolidated VerilogA model of the magnetic device, for optimized designThis consolidated model will be based on the preliminary model, but tuned using the characterization results of the technology, for better accuracy. A specific model card will be developped to adapt the model to this technology.
Consolidated standard cell libraryThe library will contain a set of Standard Cells (SC), elementary logic functions to synthetize more complex logic circuits. The variety of the cells will represent various design corners (low-power area efficient, fast, resilient cells...) and cover different output capacitive loads.
Magnetic technology files and integration in the design suite for the physical verificationsThis technology files are part of a Process Design Kit (PDK) allowing to integrate the technology in the standard design suites of microelectronics. It will contain in particular : - Technology files containing the design rules provided by Spintec or Tower for Design Rules Checking, -technology files giving the informations about the technology to perform extraction of the circuit.
This Management Plan is a mandatory deliverable of the GREAT project, but is also considered as a key feature for the management of the project. It has been designed to be the official Project Handbook for any participant to GREAT. Any project member (project managers, engineer, scientist, etc.) should read it at least once. The main management features described in this document is: 1) Management structures that describe the formal project management organization and responsibilities sharing. 2) Management processes which are working routines and practices that each person participating to the project should apply. 3) Management tools that are techniques, medium or reference documents that help the implementation of the management process.
2nd Management Periodic ReportThe Management Periodic Report provides an explanation of personnel costs, subcontracting and any major costs incurred by each beneficiary, such as the purchase of important equipment, travel costs, large consumable items, etc., linking them to work packages.
Validation of the first test chip for each IP block.This report will include all public information regarding the design of IP blocks within tasks 3.1 (Sensors) and 3.3 (MSS-controlled digital tuning circuits). MTJ-based sensors should include magnetic-field sensors for compass applications and some additional sensors that use the magnetic field as an intermediate physical magnitude. On this later principle, two applications have been identified: a voltmeter with a high galvanic isolation and an ammeter. One particular targeted IP block is a smart power-PAD that would be able to monitor the instantaneous power delivered at the better or that would be able to inform instantaneously if the delivered power goes higher than a fixed an/or programmable threshold is reached. Digital tuning circuits will include a family of analog elementary functions (voltage and current sources, OTA) that will include a non-volatile digital tuning of the main characteristic (output voltage or current, transconductance of the OTA) to replace fuse-based approach when compensating for variability. Detailed and restricted information will be given in a restricted annex.
1st Community Periodic ContributionA report on the distribution of the European Union financial contribution between beneficiaries will be submitted after GREAT first period.
Report about demonstration of the sensor functionality using the MSS stackThis report will present the test results of the MSS stack used for sensor applications. In particular, the following performances will be evaluated: - Sensistivity of the sensor, - Linearity of the response, - Low-hysteresis.
1st Management Periodic ReportThe Management Periodic Report provides an explanation of personnel costs, subcontracting and any major costs incurred by each beneficiary, such as the purchase of important equipment, travel costs, large consumable items, etc., linking them to work packages.
2nd Community Periodic ContributionA 2nd report on the distribution of the European Union financial contribution between beneficiaries will be submitted after GREAT second period.
Report about demonstration of the memory functionality using the MSS stackReport about memory functionality, with particular focus on retention versus size and ellipse aspect ratio
Report about demonstration of RF functionality using the MSS stackUsing the MSS stack, magnetic nanopillar devices will be realized and the RF functions investigated. These functions consider the emission of a microwave voltage signal, with properties that are suitable for integration into a PLL (D3.2). Other functions, such as modulation and detection will also be considered were suitable.
2nd Dissemination & Promotion of project resultsThe Report on dissemination and promotion of the project’s results (including socio-economic impact and target groups for the results of the research) is established on a periodic base. It is a short focus of GREAT exploitable knowledge and summarizes the activities targeting scientific community, industry and general public. It includes 3 summary tables of the dissemination and promotion activities in these 3 fields. This document aims at screening the different results partners have obtained thanks to this project and how they are willing to exploit but also disseminate it.
Final IP documentationThis report will include all public information with respect to the designed IP blocks within tasks 3.1 (Sensors) and 3.3 (MSS-controlled digital tuning circuits). Expected and/or obtained performances will be given in a form close to a data sheet for each IP blocks. Detailed and restricted information will be given in a restricted annex.
Report on Ø300mm wafer processing methodology, WiW and WtW uniformityWiW: TMR and RA uniformity <6% @ RA=10 Ohm.µm². WtW: TMR and RA <4% @ RA=10 Ohm.µm².
Report on hybrid memory hierarchy and processor architecture design techniques providing density, performance, low power and resilienceThis report will summarize the results of the hybrid memory hierarchy (Registers, FFs, caches, etc.) analysis for a variety of processor architectures (e.g. GPUs, DSPs, standard many-core microprocessors). The focus will be on resiliency, low-power, high density and performance.
The Partners will establish within the first 6 months a “great.eu” home page on a World Wide Web (www) server accessible via the Internet. In an area restricted to project partners and the European Commission (password protected), it will provide: the “Description of Action” for the contract, work schedules and logistics information, updates on deliverables, news and project report, issues regarding dissemination, also including abstracts of papers and presentations…
One publication on micromagnetic modellingThe publication will analyze via micromagnetic simulations the magnetic behavior of the MTJs of MSS under magnetic field and spin-polarized current.
Project PresentationThe Project Presentation is a short description of GREAT objectives, goals, approach, expected results and participants. The purpose of this document is to use it for dissemination of GREAT and all the information included here will also be included in the project web site.
Publications
Author(s):
Ma, R.; Tibenszky, Z.; Kreißig, M.; Ellinger, F.
Published in:
2019
Publisher:
IEEE European Integrated Microwave Circuits Conference
Author(s):
Ma, R.; Kreißig, M.; Ellinger, F.
Published in:
2018
Publisher:
IEEE International Conference on Electronics, Circuits and Systems (ICECS)
Author(s):
Sophiane Senni, Frederic Ouattara, Jad Modad, Kaan Sevin, Guillaume Patrigeon, Pascal Benoit, Pascal Nouet, Lionel Torres, Francois Duhem, Gregory Di Pendina, Guillaume Prenat
Published in:
2018 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2018, Page(s) 188-191, ISBN 978-1-5386-4756-1
Publisher:
IEEE
DOI:
10.1109/VLSI-SoC.2018.8644875
Author(s):
Mehdi Tahoori, Sarath Mohanachandran Nair, Rajendra Bishnoi, Sophiane Senni, Jad Mohdad, Frederick Mailly, Lionel Torres, Pascal Benoit, Pascal Nouet, Rui Ma, Martin KreiBig, Frank Ellinger, Kotb Jabeur, Pierre Vanhauwaert, Gregory Di Pendina, Guillaume Prenat
Published in:
2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2017, Page(s) 344-349, ISBN 978-1-5090-6762-6
Publisher:
IEEE
DOI:
10.1109/ISVLSI.2017.67
Author(s):
Patrigeon , Guillaume; Leloup , Paul; Benoit , Pascal; Torres , Lionel
Published in:
SAS: Sensors Applications Symposium, Issue 7, 2019
Publisher:
IEEE
Author(s):
Odilia Coi, Guillaume Patrigeon, Sophiane Senni, Lionel Torres, Pascal Benoit
Published in:
2017 IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH), 2017, Page(s) 39-44, ISBN 978-1-5090-6037-5
Publisher:
IEEE
DOI:
10.1109/NANOARCH.2017.8053704
Author(s):
Guillaume Patrigeon, Pascal Benoit, Lionel Torres
Published in:
2018 28th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), 2018, Page(s) 123-128, ISBN 978-1-5386-6365-3
Publisher:
IEEE
DOI:
10.1109/PATMOS.2018.8464173
Author(s):
I. Shankhour, J. Mohdad, F. Mailly and P. Nouet
Published in:
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), Roma, 2018, pp. 1-4, 2018
Publisher:
IEEE
Author(s):
M. Tahoori, S. M. Nair, R. Bishnoi, S. Senni, J. Mohdad, F. Mailly, L. Torres, P. Benoit, A. Gamatie, P. Nouet, F. Ouattara, G. Sassatelli, K. Jabeur, P. Vanhauwaert, A. Atitoaie, I. Firastrau, G. Di Pendina, G. Prenat
Published in:
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 2018, Page(s) 931-936, ISBN 978-3-9819263-0-9
Publisher:
IEEE
DOI:
10.23919/date.2018.8342143
Author(s):
Luc Tillie, Jyotirmoy Chatterjee, Ricardo Sousa, Stephane Auffret, Jude Guelfucci, Etienne Nowak, Bernard Dieny, Ioan-Lucian Prejbeanu, N. Lamard
Published in:
2018 IEEE International Memory Workshop (IMW), 2018, Page(s) 1-4, ISBN 978-1-5386-5247-3
Publisher:
IEEE
DOI:
10.1109/imw.2018.8388854
Author(s):
L. Tillie, B. Dieny, R. C. Sousa, J. Chatterjee, S. Auffret, N. Lamard, J. Guelffucci, E. Nowak, I.L. Prejbeanu
Published in:
2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2018, Page(s) 1-2, ISBN 978-1-5386-4825-4
Publisher:
IEEE
DOI:
10.1109/vlsi-tsa.2018.8403857
Author(s):
U. Ebels, J. Hem, A. Purbawati, A. Ruiz Calafora, C. Murapaka, L. Vila, K. Jaimes Merazzo, E. Jimenez, M.-C. Cyrille, R. Ferreira, M. Kreissig, R. Ma, F. Ellinger, R. Lebrun, S. Wittrock, V. Cros, P. Bortolotti
Published in:
2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFC), 2017, Page(s) 66-67, ISBN 978-1-5386-2916-1
Publisher:
IEEE
DOI:
10.1109/fcs.2017.8088802
Author(s):
Odilia Coi, Guillaume Patrigeon, Sophiane Senni, Lionel Torres, Pascal Benoit
Published in:
IEEE/ACM International Symposium on Nanoscale Architectures, Issue July 2017, 2017
Publisher:
IEEE/ACM
Author(s):
Sophiane Senni, Thibaud Delobelle, Odilia Coi, Pierre-Yves Peneau, Lionel Torres, Abdoulaye Gamatie, Pascal Benoit and Gilles Sassatelli
Published in:
IEEE DATE 2017 Conference, Issue March 2017, 2017, ISSN 1558-1101
Publisher:
IEEE DATE
DOI:
10.23919/DATE.2017.7927046
Author(s):
Lionel Torres, Sophiane Senni
Published in:
Issue May 2017, 2017
Publisher:
INRIA
Author(s):
Lionel Torres
Published in:
Issue October 2016, 2016
Publisher:
EEA
Author(s):
R. Ma, A. Purbawati, M. Kreisig, F. Protze, A. Ruiz-Calaforra, J. Hem, U. Ebels, F. Ellinger
Published in:
2017 13th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), 2017, Page(s) 1-4, ISBN 978-1-5090-6508-0
Publisher:
IEEE
DOI:
10.1109/PRIME.2017.7974092
Author(s):
I. L. Prejbeanu, R.C. Sousa, B. Dieny
Published in:
THE 9th INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS, ROCAM 2017, 2017
Publisher:
ROCAM
Author(s):
I. L. Prejbeanu, A. Timopheev, M. Miron, G. Gaudin, B. Lacoste, T. Devolder, M. Marins de Castro, R. C. Sousa, L. D. Buda-Prejbeanu, S. Auffret, U. Ebels, B. Rodmacq, B. Dieny
Published in:
Joint York-Tohoku-Kaiserslautern Symposium on spintronics, 2017
Publisher:
York-Tohoku-Kaiserslautern Symposium
Author(s):
Chatterjee J, Sousa R, Auffret S and Dieny B.
Published in:
IEEE International Magnetics Conference INTERMAG Europe, 2017
Publisher:
IEEE, ITERMAG
Author(s):
Guillaume Patrigeon, Pascal Benoit, Lionel Torres, Sophiane Senni, Guillaume Prenat, Gregory Di Pendina
Published in:
IEEE Access, Issue 7, 2019, Page(s) 58085-58093, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/ACCESS.2019.2906942
Author(s):
Sophiane Senni, Lionel Torres, Gilles Sassatelli, Abdoulaye Gamatie
Published in:
ACM Journal on Emerging Technologies in Computing Systems, Issue 13/2, 2017, Page(s) 1-23, ISSN 1550-4832
Publisher:
Association for Computing Machinary, Inc.
DOI:
10.1145/3001936
Author(s):
Sophiane Senni, Lionel Torres, Pascal Benoit, Abdoulaye Gamatie, Gilles Sassatelli
Published in:
IEEE Magnetics Letters, Issue 2017-07-19, 2017, Page(s) 1-1, ISSN 1949-307X
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/LMAG.2017.2712780
Author(s):
Bernard Dieny, I. Lucian Prejbeanu
Published in:
"Introduction to Magnetic Random&;#x02010;Access Memory", 2017, Page(s) 101-164, ISBN 9781-119079415
Publisher:
"John Wiley &;#38; Sons, Inc."
DOI:
10.1002/9781119079415.ch5
Author(s):
Liliana D. Buda&xPrejbeanu
Published in:
"Introduction to Magnetic Random&;#x02010;Access Memory", 2017, Page(s) 55-78, ISBN 9781-119079415
Publisher:
"John Wiley &;#38; Sons, Inc."
DOI:
10.1002/9781119079415.ch3
Author(s):
A. Chavent, V. Iurchuk, L.Tillie, Y. Bel, L. Vila, U. Ebels R. Sousa B. Dieny, G. di Pendina, G. Prenat, J. Langer, J. Wrona, I. L. Prejbeanu
Published in:
Special MRAM poster session at IEDM, poster presentation, 2018
Publisher:
IEDM
Author(s):
Antoine Chavent, Vadym Iurchuk, Luc Tillie, Yoann Bel, Nathalie Lamard, Laurent Vila, Ursula Ebels, Ricardo C. Sousa, Bernard Dieny, Gregory Di Pendina, Guillaume Prenat, Juergen Langer, Jerzy Wrona, Ioan Lucian Prejbeanu
Published in:
Oral presentation at JEMS 2019, 2019
Publisher:
JEMS
Author(s):
LIRMM & KIT (2 papers accepted)
Published in:
DATE 2017, 2017
Publisher:
IEEE
Author(s):
Sophiane Senni, Lionel Torres
Published in:
IEDM, Issue 5-7 Dec 2016, 2016
Publisher:
IEDM
Author(s):
L. Torres
Published in:
Issue 3-5 july 2017, 2017
Publisher:
LIRMM
Author(s):
P. Nouet
Published in:
Issue 3 et 4 juillet 2017, 2017
Publisher:
CNRS
Author(s):
Abdoulaye Gamatié
Published in:
Issue January 2017, 2017
Publisher:
FETCH
Author(s):
Alexandru Atitoaie(1), Marius Volmer(1), Liliana Buda-Prejbeanu(2,3,4), Ursula Ebels(2,3,4), Ioana Firastrau(1), (1)Transilvania University of Brasov, 500036, Brasov, Romania, (2)Univ. Grenoble Alpes, F-38000, Grenoble, France, (3)CEA, INAC – SPINTEC, F-38000, Grenoble, France, (4) CNRS, SPINTEC, F-38000, Grenoble, France
Published in:
11th International Symposium on Hysteresis Modeling and Micromagnetism, 2017
Publisher:
HMM
Author(s):
Alexandru Atitoaie(1), Marius Volmer(1), Liliana Buda-Prejbeanu(2,3,4), Ursula Ebels(2,3,4), Ioana Firastrau(1), (1)Transilvania University of Brasov, 500036, Brasov, Romania, (2)Univ. Grenoble Alpes, F-38000, Grenoble, France, (3)CEA, INAC – SPINTEC, F-38000, Grenoble, France, (4) CNRS, SPINTEC, F-38000, Grenoble, France
Published in:
11th International Symposium on Hysteresis Modeling and Micromagnetism, 2017
Publisher:
HMM
Author(s):
J. Wrona, J. Langer, S. Tibus, B. Ocker, J. Kanak, M. Cecot, T. Stobiecki
Published in:
13th Joint MMM-Intermag Conference, 2016
Publisher:
MMM-Intermag
Author(s):
J. Wrona, J. Langer, S. Tibus, B. Ocker
Published in:
IEDM special poster session on MRAM, 2016
Publisher:
IEEE International Electron Devices Meeting (IEDM)
Author(s):
Alexandru Atitoaie(1), Marius Volmer(1), Liliana D. Buda-Prejbeanu(2,3,4), Ursula Ebels(2,3,4), Ioana Firastrau(1), (1)Transilvania University of Brasov, 500036, Brasov, Romania, (2)Univ. Grenoble Alpes, F-38000, Grenoble, France, (3)CEA, INAC – SPINTEC, F-38000, Grenoble, France, (4) CNRS, SPINTEC, F-38000, Grenoble, France
Published in:
The 9th International Conference on Advanced Materials, ROCAM2017, 2017
Publisher:
ROCAM
Author(s):
J. Wrona, M. Zhu, J. Langer, S. Tibus, M. Smalley, S. Bennett, B. Ocker
Published in:
61th Annual Conference on Magnetism and Magnetic Materials, 2016
Publisher:
MMM
Author(s):
Jürgen Langer
Published in:
Fraunhofer IPMS - CNT Industry Partner Day Innovative: Modules for IoT, 2016
Publisher:
Fraunhofer IPMS
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