High density scalable optically interconnected Tb/s Board

Informations projet

Teraboard

N° de convention de subvention: 688510

DOI 10.3030/688510

Projet clôturé

Date de signature de la CE 11 Novembre 2015

Date de début 1 Decembre 2015

Date de fin 30 Novembre 2019

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total € 4 249 157,50

Contribution de l’UE € 4 249 157,50

Coordonné par

CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI
Italy

Livrables

Websites, patent fillings, videos etc. (5)

TERABOARD communication Kit
TERABOARD communication Kit

Teraboard dissemination kit

TERABOARD communication Kit
Press release

Press release on Teraboard project

Press release

Press release on Teraboard project

Documents, reports (2)

Data Management Plan
Final publishable activity report

Publications

Peer reviewed articles (6)

DAC-Less and DSP-Free 112 Gb/s PAM-4 Transmitter Using Two Parallel Electroabsorption Modulators

Auteurs: Jochem Verbist, Joris Lambrecht, Michiel Verplaetse, Joris Van Kerrebrouck, Ashwyn Srinivasan, Peter De Heyn, Timothy De Keulenaer, Xin Yin, Guy Torfs, Joris Van Campenhout, Gunther Roelkens, Johan Bauwelinck
Publié dans: Journal of Lightwave Technology, Numéro 36/5, 2018, Page(s) 1281-1286, ISSN 0733-8724
Éditeur: Optical Society of America
DOI: 10.1109/jlt.2017.2789164

A 106-Gb/s PAM-4 Silicon Optical Receiver

Auteurs: Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin
Publié dans: IEEE Photonics Technology Letters, Numéro 31/7, 2019, Page(s) 505-508, ISSN 1041-1135
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/lpt.2019.2899147

90-Gb/s NRZ Optical Receiver in Silicon Using a Fully Differential Transimpedance Amplifier

Auteurs: Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michiel Verplaetse, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin
Publié dans: Journal of Lightwave Technology, Numéro 37/9, 2019, Page(s) 1964-1973, ISSN 0733-8724
Éditeur: Optical Society of America
DOI: 10.1109/jlt.2019.2896757

Low-Power 56Gb/s NRZ Microring Modulator Driver in 28nm FDSOI CMOS

Auteurs: Hannes Ramon, Xin Yin, Johan Bauwelinck, Michael Vanhoecke, Jochem Verbist, Wouter Soenen, Peter De Heyn, Yoojin Ban, Marianna Pantouvaki, Joris Van Campenhout, Peter Ossieur
Publié dans: IEEE Photonics Technology Letters, Numéro 30/5, 2018, Page(s) 467-470, ISSN 1041-1135
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/lpt.2018.2799004

Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing

Auteurs: Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas de Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Günther Roelkens, Dries Van Thourhout
Publié dans: Optics Express, Numéro 26/17, 2018, Page(s) 21443, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/oe.26.021443

70 Gb/s Low-Power DC-Coupled NRZ Differential Electro-Absorption Modulator Driver in 55 nm SiGe BiCMOS

Auteurs: Hannes Ramon, Johan Bauwelinck, Joris Lambrecht, Jochem Verbist, Michael Vanhoecke, Srinivasan Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Peter Ossieur, Xin Yin
Publié dans: Journal of Lightwave Technology, Numéro 37/5, 2019, Page(s) 1504-1514, ISSN 0733-8724
Éditeur: Optical Society of America
DOI: 10.1109/jlt.2019.2900192

Conference proceedings (19)

New Materials for Active Devices in Silicon Photonics

Auteurs: D. Van Thourhout
Publié dans: The 7th Conference on Advances in Optoelectronics and Micro/nano-optics, 2018
Éditeur: AOM - The 7th Conference on Advances in Optoelectronics and Micro/nano-optics (invited)

Frontiers in III-V Laser Integration on Silicon Photonic Integrated Circuits

Auteurs: G. Roelkens
Publié dans: 2018 IEEE International Semiconductor Laser Conference (ISLC), 2018, Page(s) 1-2, ISBN 978-1-5386-6486-5
Éditeur: IEEE
DOI: 10.1109/islc.2018.8516171

Transfer Printing for Silicon Photonics Transceivers and Interposers

Auteurs: G. Roelkens, J. Zhang, A. De Groote, J. Juvert, N. Ye, S. Kumari, J. Goyvaerts, G. Muliuk, S. Uvin, G. Chen, B. Haq, B. Snyder, J. Van Campenhout, D. Van Thourhout, A. J. Trindade, C.A. Bower, J. O'Callaghan, R. Loi, B. Roycroft, B. Corbett
Publié dans: 2018 IEEE Optical Interconnects Conference (OI), 2018, Page(s) 13-14, ISBN 978-1-5386-5352-4
Éditeur: IEEE
DOI: 10.1109/oic.2018.8422030

Micro-transfer printing for advanced scalable hybrid photonic integration

Auteurs: R. Loi, B. Roycroft, J. O'Callaghan, J. Justice, A. Gocalinski, E. Peluchi, A.J. Trindade, C.A. Bower, Günther Roelkens (UGent) and B. Corbett
Publié dans: Europen Conference on Integrated Optics, 2018
Éditeur: Europen Conference on Integrated Optics

100 Gb/s DAC-less and DSP-free Transmitters using GeSi EAMs for Short-Reach Optical Interconnects

Auteurs: Jochem Verbist, Michiel Verplaetse, Joris Lambrecht, Srinivasan Ashwyn Srivinasan, Peter De Heyn, Timothy De Keulenaer, Ramses Pierco, Arno Vyncke, Philippe Absil, Xin Yin, Guy Torfs, Joris Van Campenhout, Gunther Roelkens, Johan Bauwelinck
Publié dans: Optical Fiber Communication Conference, 2018, Page(s) W4D.4, ISBN 978-1-943580-38-5
Éditeur: OSA
DOI: 10.1364/ofc.2018.w4d.4

DAC-less and DSP-free PAM-4 Transmitter at 112 Gb/s with Two Parallel GeSi Electro-Absorption Modulators

Auteurs: J. Verbist, J. Lambrecht, M. Verplaetse, J. Van Kerrebrouck, S. A. Srinivasan, P. De Heyn, T. De Keulenaer, X. Yin, J. Van Campenhout, G. Roelkens, J. Bauwelinck
Publié dans: 2017 European Conference on Optical Communication (ECOC), 2017, Page(s) 1-3, ISBN 978-1-5386-5624-2
Éditeur: IEEE
DOI: 10.1109/ecoc.2017.8346098

Integration of III-V light sources on a silicon photonics circuit by transfer printing

Auteurs: Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas De Groote, Brad Snyder, Peter De Heyn, Peter Verheyen, Antonio Jose Trindade, Christopher Bower, Marco Romagnoli, Gunther Roelkens, Dries Van Thourhout
Publié dans: 2017 IEEE 14th International Conference on Group IV Photonics (GFP), 2017, Page(s) 171-172, ISBN 978-1-5090-6568-4
Éditeur: IEEE
DOI: 10.1109/group4.2017.8082251

Real-time 100 Gb/s NRZ-OOK transmission with a silicon photonics GeSi electro-absorption modulator

Auteurs: J. Verbist, M. Verplaetse, S. A. Srinivasan, P. De Heyn, T. De Keulenaer, R. Vaernewyck, R. Pierco, A. Vyncke, P. Verheyen, S. Balakrishnan, G. Lepage, M. Pantouvaki, P. Absil, X. Yin, G. Roelkens, G. Torfs, J. Van Campenhout, J. Bauwelinck
Publié dans: 2017 IEEE Optical Interconnects Conference (OI), 2017, Page(s) 29-30, ISBN 978-1-5090-5016-1
Éditeur: IEEE
DOI: 10.1109/oic.2017.7965515

TSV-enabled Hybrid FinFET CMOS – Silicon Photonics Technology for High Density Optical I/O

Auteurs: D. Guermandi et al.,
Publié dans: ECOC 2019, 2019
Éditeur: ECOC 2019

High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform

Auteurs: L. Bogaerts, Z. El-Mekki, S. Van Huylenbroeck, P. Nolmans, N. Pantano, X. Sun, M. Rakowski, D. Velenis, P. Verheyen, S. Balakrishnan, P. De Heyn, B. Snyder, Y. Ban, S. Srinivasan, S. Lardenois, J. De Coster, M. Detalle, P. Absil, A. Miller, M. Pantouvaki, J. Van Campenhout
Publié dans: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018, Page(s) 1-3, ISBN 978-1-5386-7627-1
Éditeur: IEEE
DOI: 10.1109/s3s.2018.8640164

Silicon Photonics for 56G NRZ Optical Interconnects

Auteurs: J. Van Campenhout et al.,
Publié dans: 2018 Optical Fiber Communications Conference and Exposition (OFC), 2018
Éditeur: IEEE

Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

Auteurs: P. Absil, K. Croes, A. Lesniewska, P. De Heyn, Y. Ban, B. Snyder, J. De Coster, F. Fodor, V. Simons, S. Balakrishnan, G. Lepage, N. Golshani, S. Lardenois, S. A. Srinivasan, H. Chen, W. Vanherle, R. Loo, R. Boufadil, M. Detalle, A. Miller, P. Verheyen, M. Pantouvaki, J. Van Campenhout
Publié dans: 2017 IEEE International Electron Devices Meeting (IEDM), 2017, Page(s) 34.2.1-34.2.4, ISBN 978-1-5386-3559-9
Éditeur: IEEE
DOI: 10.1109/iedm.2017.8268494

Electronic Circuits for High Speed PON beyond 25G

Auteurs: Xin Yin, Joris Lambrecht, Gertjan Coudyzer, Jochem Verbist, Hannes Ramon, Peter Ossieur, Guy Torfs, Johan Bauwelinck
Publié dans: Optical Fiber Communication Conference (OFC) 2019, 2019, Page(s) W4J.3, ISBN 978-1-943580-53-8
Éditeur: OSA
DOI: 10.1364/ofc.2019.w4j.3

56-Gb/s silicon optical receiver using a low-noise fully-differential transimpedance amplifier in SiGe BiCMOS

Auteurs: Joris Lambrecht (UGent) , Hannes Ramon (UGent) , Bart Moeneclaey (UGent) , Jochem Verbist (UGent) , Peter Ossieur (UGent) , Peter De Heyn (UGent) , Joris Van Campenhout, Johan Bauwelinck (UGent) and Xin Yin (UGent)
Publié dans: ECOC2018, the 44th European Conference on Optical Communications, 2018
Éditeur: ECOC 2018

70 Gb/s 0.87 pJ/bit GeSi EAM Driver in 55 nm SiGe BiCMOS

Auteurs: Hannes Ramon, Joris Lambrecht, Jochem Verbist, Michael Vanhoecke, Srinivasan Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Peter Ossieur, Xin Yin, Johan Bauwelinck
Publié dans: 2018 European Conference on Optical Communication (ECOC), 2018, Page(s) 1-3, ISBN 978-1-5386-4862-9
Éditeur: IEEE
DOI: 10.1109/ecoc.2018.8535467

Electronic ICs for Silicon Photonic Transceivers

Auteurs: P. Ossieur, H. Ramon, J. Lambrechts, M. Vanhoecke, L. Breyne, S. Zhou, S. Facchin, P. D. Townsend, G. Torfs, X. Yin, J. Bauwelinck
Publié dans: 2018 IEEE 15th International Conference on Group IV Photonics (GFP), 2018, Page(s) 1-2, ISBN 978-1-5386-5361-6
Éditeur: IEEE
DOI: 10.1109/group4.2018.8478741

Longitudinal writing of vertical waveguides in fused silica: Toward new integrated photonic technologies (Conference Presentation)

Auteurs: Diogo Pereira Lopes, Rebeca Martínez Vázquez, Luigi Tallone, Marco Romagnoli, Roberto Osellame
Publié dans: Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVIII, 2018, Page(s) 20, ISBN 9781-510615304
Éditeur: SPIE
DOI: 10.1117/12.2290272

Internode interconnection optical platform based on fs-laser written vertical waveguides

Auteurs: R. Vázquez et al.
Publié dans: SPIE OPTO 2018, SPIE Photonic West 2018, 2018
Éditeur: SPIE OPTO 2018

First Real-Time 100-Gb/s NRZ-OOK Transmission over 2 km with a Silicon Photonic Electro-Absorption Modulator

Auteurs: jochem verbist, Michiel Verplaetse, Ashwyn Srinivasan, Peter De Heyn, Timothy De Keulenaer, Ramses Pierco, Renato Vaernewyck, Arno Vyncke, Philippe Absil, Guy Torfs, Xin Yin, Gunther Roelkens, Joris Van Campenhout, Johan Bauwelinck
Publié dans: Optical Fiber Communication Conference Postdeadline Papers, 2017, Page(s) Th5C.4, ISBN 978-1-943580-24-8
Éditeur: OSA
DOI: 10.1364/OFC.2017.Th5C.4

Non-peer reviewed articles (2)

III-V-on-Silicon Integration

Auteurs: Dries Van Thourhou, Zhechao Wang, Günther Roelkens
Publié dans: Optics and Photonics News, Numéro 28/3, 2017, Page(s) 32, ISSN 1047-6938
Éditeur: Optical Society of America
DOI: 10.1364/opn.28.3.000032

Teraboard Project Closing in on Future of Telecommunications

Auteurs: Ana Belén González, Jose Pozo
Publié dans: Optik & Photonik, Numéro 12/1, 2017, Page(s) 24-25, ISSN 1863-1460
Éditeur: WILEY-VCH Verlag GmbH & Co. KGaA
DOI: 10.1002/opph.201790006