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High density scalable optically interconnected Tb/s Board

Deliverables

TERABOARD communication Kit

TERABOARD communication Kit

TERABOARD communication Kit

Teraboard dissemination kit

TERABOARD communication Kit

TERABOARD communication Kit

Press release

Press release on Teraboard project

Press release

Press release on Teraboard project

Data Management Plan

Data Management Plan

Final publishable activity report

Final publishable activity report

Publications

DAC-Less and DSP-Free 112 Gb/s PAM-4 Transmitter Using Two Parallel Electroabsorption Modulators

Author(s): Jochem Verbist, Joris Lambrecht, Michiel Verplaetse, Joris Van Kerrebrouck, Ashwyn Srinivasan, Peter De Heyn, Timothy De Keulenaer, Xin Yin, Guy Torfs, Joris Van Campenhout, Gunther Roelkens, Johan Bauwelinck
Published in: Journal of Lightwave Technology, Issue 36/5, 2018, Page(s) 1281-1286, ISSN 0733-8724
DOI: 10.1109/jlt.2017.2789164

A 106-Gb/s PAM-4 Silicon Optical Receiver

Author(s): Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin
Published in: IEEE Photonics Technology Letters, Issue 31/7, 2019, Page(s) 505-508, ISSN 1041-1135
DOI: 10.1109/lpt.2019.2899147

90-Gb/s NRZ Optical Receiver in Silicon Using a Fully Differential Transimpedance Amplifier

Author(s): Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michiel Verplaetse, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin
Published in: Journal of Lightwave Technology, Issue 37/9, 2019, Page(s) 1964-1973, ISSN 0733-8724
DOI: 10.1109/jlt.2019.2896757

Low-Power 56Gb/s NRZ Microring Modulator Driver in 28nm FDSOI CMOS

Author(s): Hannes Ramon, Xin Yin, Johan Bauwelinck, Michael Vanhoecke, Jochem Verbist, Wouter Soenen, Peter De Heyn, Yoojin Ban, Marianna Pantouvaki, Joris Van Campenhout, Peter Ossieur
Published in: IEEE Photonics Technology Letters, Issue 30/5, 2018, Page(s) 467-470, ISSN 1041-1135
DOI: 10.1109/lpt.2018.2799004

Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing

Author(s): Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas de Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Günther Roelkens, Dries Van Thourhout
Published in: Optics Express, Issue 26/17, 2018, Page(s) 21443, ISSN 1094-4087
DOI: 10.1364/oe.26.021443

70 Gb/s Low-Power DC-Coupled NRZ Differential Electro-Absorption Modulator Driver in 55 nm SiGe BiCMOS

Author(s): Hannes Ramon, Johan Bauwelinck, Joris Lambrecht, Jochem Verbist, Michael Vanhoecke, Srinivasan Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Peter Ossieur, Xin Yin
Published in: Journal of Lightwave Technology, Issue 37/5, 2019, Page(s) 1504-1514, ISSN 0733-8724
DOI: 10.1109/jlt.2019.2900192

New Materials for Active Devices in Silicon Photonics

Author(s): D. Van Thourhout
Published in: The 7th Conference on Advances in Optoelectronics and Micro/nano-optics, 2018

Frontiers in III-V Laser Integration on Silicon Photonic Integrated Circuits

Author(s): G. Roelkens
Published in: 2018 IEEE International Semiconductor Laser Conference (ISLC), 2018, Page(s) 1-2
DOI: 10.1109/islc.2018.8516171

Transfer Printing for Silicon Photonics Transceivers and Interposers

Author(s): G. Roelkens, J. Zhang, A. De Groote, J. Juvert, N. Ye, S. Kumari, J. Goyvaerts, G. Muliuk, S. Uvin, G. Chen, B. Haq, B. Snyder, J. Van Campenhout, D. Van Thourhout, A. J. Trindade, C.A. Bower, J. O'Callaghan, R. Loi, B. Roycroft, B. Corbett
Published in: 2018 IEEE Optical Interconnects Conference (OI), 2018, Page(s) 13-14
DOI: 10.1109/oic.2018.8422030

Micro-transfer printing for advanced scalable hybrid photonic integration

Author(s): R. Loi, B. Roycroft, J. O'Callaghan, J. Justice, A. Gocalinski, E. Peluchi, A.J. Trindade, C.A. Bower, Günther Roelkens (UGent) and B. Corbett
Published in: Europen Conference on Integrated Optics, 2018

100 Gb/s DAC-less and DSP-free Transmitters using GeSi EAMs for Short-Reach Optical Interconnects

Author(s): Jochem Verbist, Michiel Verplaetse, Joris Lambrecht, Srinivasan Ashwyn Srivinasan, Peter De Heyn, Timothy De Keulenaer, Ramses Pierco, Arno Vyncke, Philippe Absil, Xin Yin, Guy Torfs, Joris Van Campenhout, Gunther Roelkens, Johan Bauwelinck
Published in: Optical Fiber Communication Conference, 2018, Page(s) W4D.4
DOI: 10.1364/ofc.2018.w4d.4

DAC-less and DSP-free PAM-4 Transmitter at 112 Gb/s with Two Parallel GeSi Electro-Absorption Modulators

Author(s): J. Verbist, J. Lambrecht, M. Verplaetse, J. Van Kerrebrouck, S. A. Srinivasan, P. De Heyn, T. De Keulenaer, X. Yin, J. Van Campenhout, G. Roelkens, J. Bauwelinck
Published in: 2017 European Conference on Optical Communication (ECOC), 2017, Page(s) 1-3
DOI: 10.1109/ecoc.2017.8346098

Integration of III-V light sources on a silicon photonics circuit by transfer printing

Author(s): Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas De Groote, Brad Snyder, Peter De Heyn, Peter Verheyen, Antonio Jose Trindade, Christopher Bower, Marco Romagnoli, Gunther Roelkens, Dries Van Thourhout
Published in: 2017 IEEE 14th International Conference on Group IV Photonics (GFP), 2017, Page(s) 171-172
DOI: 10.1109/group4.2017.8082251

Real-time 100 Gb/s NRZ-OOK transmission with a silicon photonics GeSi electro-absorption modulator

Author(s): J. Verbist, M. Verplaetse, S. A. Srinivasan, P. De Heyn, T. De Keulenaer, R. Vaernewyck, R. Pierco, A. Vyncke, P. Verheyen, S. Balakrishnan, G. Lepage, M. Pantouvaki, P. Absil, X. Yin, G. Roelkens, G. Torfs, J. Van Campenhout, J. Bauwelinck
Published in: 2017 IEEE Optical Interconnects Conference (OI), 2017, Page(s) 29-30
DOI: 10.1109/oic.2017.7965515

TSV-enabled Hybrid FinFET CMOS – Silicon Photonics Technology for High Density Optical I/O

Author(s): D. Guermandi et al.,
Published in: ECOC 2019, 2019

High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform

Author(s): L. Bogaerts, Z. El-Mekki, S. Van Huylenbroeck, P. Nolmans, N. Pantano, X. Sun, M. Rakowski, D. Velenis, P. Verheyen, S. Balakrishnan, P. De Heyn, B. Snyder, Y. Ban, S. Srinivasan, S. Lardenois, J. De Coster, M. Detalle, P. Absil, A. Miller, M. Pantouvaki, J. Van Campenhout
Published in: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018, Page(s) 1-3
DOI: 10.1109/s3s.2018.8640164

Silicon Photonics for 56G NRZ Optical Interconnects

Author(s): J. Van Campenhout et al.,
Published in: 2018 Optical Fiber Communications Conference and Exposition (OFC), 2018

Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

Author(s): P. Absil, K. Croes, A. Lesniewska, P. De Heyn, Y. Ban, B. Snyder, J. De Coster, F. Fodor, V. Simons, S. Balakrishnan, G. Lepage, N. Golshani, S. Lardenois, S. A. Srinivasan, H. Chen, W. Vanherle, R. Loo, R. Boufadil, M. Detalle, A. Miller, P. Verheyen, M. Pantouvaki, J. Van Campenhout
Published in: 2017 IEEE International Electron Devices Meeting (IEDM), 2017, Page(s) 34.2.1-34.2.4
DOI: 10.1109/iedm.2017.8268494

Electronic Circuits for High Speed PON beyond 25G

Author(s): Xin Yin, Joris Lambrecht, Gertjan Coudyzer, Jochem Verbist, Hannes Ramon, Peter Ossieur, Guy Torfs, Johan Bauwelinck
Published in: Optical Fiber Communication Conference (OFC) 2019, 2019, Page(s) W4J.3
DOI: 10.1364/ofc.2019.w4j.3

56-Gb/s silicon optical receiver using a low-noise fully-differential transimpedance amplifier in SiGe BiCMOS

Author(s): Joris Lambrecht (UGent) , Hannes Ramon (UGent) , Bart Moeneclaey (UGent) , Jochem Verbist (UGent) , Peter Ossieur (UGent) , Peter De Heyn (UGent) , Joris Van Campenhout, Johan Bauwelinck (UGent) and Xin Yin (UGent)
Published in: ECOC2018, the 44th European Conference on Optical Communications, 2018

70 Gb/s 0.87 pJ/bit GeSi EAM Driver in 55 nm SiGe BiCMOS

Author(s): Hannes Ramon, Joris Lambrecht, Jochem Verbist, Michael Vanhoecke, Srinivasan Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Peter Ossieur, Xin Yin, Johan Bauwelinck
Published in: 2018 European Conference on Optical Communication (ECOC), 2018, Page(s) 1-3
DOI: 10.1109/ecoc.2018.8535467

Electronic ICs for Silicon Photonic Transceivers

Author(s): P. Ossieur, H. Ramon, J. Lambrechts, M. Vanhoecke, L. Breyne, S. Zhou, S. Facchin, P. D. Townsend, G. Torfs, X. Yin, J. Bauwelinck
Published in: 2018 IEEE 15th International Conference on Group IV Photonics (GFP), 2018, Page(s) 1-2
DOI: 10.1109/group4.2018.8478741

Longitudinal writing of vertical waveguides in fused silica: Toward new integrated photonic technologies (Conference Presentation)

Author(s): Diogo Pereira Lopes, Rebeca Martínez Vázquez, Luigi Tallone, Marco Romagnoli, Roberto Osellame
Published in: Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVIII, 2018, Page(s) 20
DOI: 10.1117/12.2290272

Internode interconnection optical platform based on fs-laser written vertical waveguides

Author(s): R. Vázquez et al.
Published in: SPIE OPTO 2018, SPIE Photonic West 2018, 2018

First Real-Time 100-Gb/s NRZ-OOK Transmission over 2 km with a Silicon Photonic Electro-Absorption Modulator

Author(s): jochem verbist, Michiel Verplaetse, Ashwyn Srinivasan, Peter De Heyn, Timothy De Keulenaer, Ramses Pierco, Renato Vaernewyck, Arno Vyncke, Philippe Absil, Guy Torfs, Xin Yin, Gunther Roelkens, Joris Van Campenhout, Johan Bauwelinck
Published in: Optical Fiber Communication Conference Postdeadline Papers, 2017, Page(s) Th5C.4
DOI: 10.1364/OFC.2017.Th5C.4

III-V-on-Silicon Integration

Author(s): Dries Van Thourhou, Zhechao Wang, Günther Roelkens
Published in: Optics and Photonics News, Issue 28/3, 2017, Page(s) 32, ISSN 1047-6938
DOI: 10.1364/opn.28.3.000032

Teraboard Project Closing in on Future of Telecommunications


Published in: ISSN 1863-1460
DOI: 10.1002/opph.201790006