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Wafer scale Integration of Photonics and Electronics

Objective

The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program.

A new wafer-scale technology will thus be developed for direct and intimate attachment of III-V Indium-Phosphide (InP) photonic integrated circuits (PICs) and BiCMOS electronic chips (ICs). The ICs contain the driver, receiver andcontrol electronics for the PIC and enable direct connection to polymer optical waveguides. This technology of ‘wafer scale heterogeneous integration’ enables high-performance and high-density photonic-electronic (photronic) modules are created having a lower energy consumption, lower packaging complexity and lower cost compared to modules using more traditional interconnection techniques like wire bonding and laser welding of fibre connections.

Next to the new bonding technology, an integrated module design technology is developed for efficient co-design of hybrid photonic and electronic modules. A library consisting of photonic/electronic standard modules, is created leveraging the process design kits (PDKs) of the most important European foundries of photonic chips in combination with a powerful BiCMOS. These tools are of significantimportance to industry, since they offer photronic module designers a standardised approach that highly facilitates the module design for SMEs and affordable manufacturing by photonic and electronic foundries. The WIPE approach will be proven by showing the feasibility of a 400Gb/s transceiver for data centre application.

Fields of science (EuroSciVoc)

CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.

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Programme(s)

Multi-annual funding programmes that define the EU’s priorities for research and innovation.

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

RIA - Research and Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-ICT-2015

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Coordinator

TECHNISCHE UNIVERSITEIT EINDHOVEN
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 1 030 188,75
Address
GROENE LOPER 3
5612 AE Eindhoven
Netherlands

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Region
Zuid-Nederland Noord-Brabant Zuidoost-Noord-Brabant
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 1 030 188,75

Participants (7)

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