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Periodic project Report for the 6th and FINAL period, M61-M66, represents the last semester's of activity. It includes the detailed progress status of each Work Package.
- Outline of the Report
During RP6, the Project succeeded to set-up the qualified and reliable 300mm Pilot Line for Smart Power and Power Discretes technology, including equipment selection, installation, and validation.
The tool installation phase started as the Clean Room has been ready (i.e. anticipated at M48) and certified by M60 (i.e. October 2022).
The electrical validation of the equipment has been achieved through the first test vehicle. The wafer lot started the process flow in the R3-PowerUP Pilot Line at the end of August 2022 and finished by October 2022 (I.e. M60). This represents the Milestone M07, achieved at M60 (initially planned at M59), in synergy with WP3.
All these wafers have showed exceptionally good electrical performance both at parametric test and electrical wafer sorting level: the overall wafer yield average was 98.5% aligned to reference product baseline.
This electrical result represents a significative achievement and validates and certifies the goodness of:
• The Pilot Line infrastructure and facilities
• The installation, hook-up, set-up of all the set of equipment needed to diffuse the silicon
• The process porting from a reference sister fab in Crolles for HCMOS9A technology
All the details are reported in the deliverables D1.5.1 and D1.5.2.
Also on WP4’s “Wafer finishing and Handling”, the task has been duly accomplished and closed at M60.
The main outcome is reported in D4.2.2 Final Report on wafer finishing and handling, released at M60.
All the expected targets in this task were achieved. A set of new materials, especially adhesive but also sacrificial dummy carrier, has been identified and characterised for the Temporary Bonding methodologies.
The issue related to Warpage and to laser detachment technology, have been proven and enhanced through the move from 200 to 300mm wafer size, as per initial goal.
Also, the feasibility of selective thinning, Taiko Ring creation and then removal with relevant wafer handling and singulation has been proven as well.
Regarding the Power package applications, the investigations trials which have been applied on new materials and processes, have shown that the new innovative assembly technologies can be qualified and used for high power density packages. Our findings so far are not only that the materials and technologies can be used but that these are also outperforming the existing packaging technologies by a factor of 3-5 times on different aspects.
Besides the package robustness and performance, these technologies also create another possibility to further improve the total power unit efficiency. One of the new technologies Package Attach Sinter (PAS), the advantages for the automotive OEM are high, especially on the TCOO for the drivetrain, therefore we see a very strong push for this back-end technology
As far as the Demonstrators in WP5 are concerned, they successfully achieved the target objectives. The task 5.3 on the individual design of demonstrators progressed as expected. Most of the application’s demonstrators have completed their developments and validation.
The application demonstrators based on silicon, i.e. D1 (Bosch), D2 (ITE) developed in BCD9S smart power technology and D5 (ST) developed in 90nm C090D in 300mm, are progressing with final test measurements and results validation. Regarding the Final equipment and industry demonstrators, D8, D9 and D10 completed by M56.
Last but not the least, the R3-PowerUP workshop, titled “Smart Power Technologies and Applications”, was held in the frame of the European ESSDERC/ESSCIRC 2022 conference. The venue of the conference events, including workshops and tutorials, was at the University of Milan-Bicocca, Milan, Italy, on 19-22 September 2022 (i.e. M59).
The complete information on the workshop, including organization details, workshop’s content, speakers, etc., can be found in the deliverable D6.1.5 duly submitted at M60. The whole set of slides presented during the workshop is fully available upon request.
The full list of Deliverables achieved during M61-M66 (RP6) il the following:
# Deliverable name
D3.3.3 1st working 300mm wafer out from R3 Pilot Line ST-I M62
D3.3.2 Test vehicle characterization report and comparison with the 200mm results ST-I M65
D4.4.3 Report on reliability characterization and test of power packaging technologies UPB M66
D5.3.1 Processing and validation of the Final Application Demonstrators ST-I M66
D6.1.4 Final dissemination and communication report IUNET M66
D6.2.2 Final exploitation plan Picosun M66
D7.2.10 Final project report on progress, use of resources and financial Statement ST-I M66
Achieved Milestones in the period.
All the milestones have been achieved and completed in RP5. No additional milestones in RP6.
Thus the full set of Milestones of R3-PowerUP have been accomplished.
