Pilot line for micro-transfer-printing of functional components on wafer level

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Internal and external IT communication infrastructure and project website

The external IT communication infrastructure constitutes a guideline for communication of the MICROPRINCE project to external target groups including conferences, marketing measures and communication channels. Furthermore this deliverable constitutes the launch of the internal MICROPRINCE communication infrastructure including the establishment of mailing lists or a subversion server, and the MICROPRINCE website.

Publications

Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications

Auteurs: Jeroen Goyvaerts, Sulakshna Kumari, Sarah Uvin, Jing Zhang, Roel Baets, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Günther Roelkens
Publié dans: Optics Express, Numéro 28/14, 2020, Page(s) 21275, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/oe.395796

A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems

Auteurs: Robert Fischbach, Tilman Horst, Jens Lienig
Publié dans: 2019 International 3D Systems Integration Conference (3DIC), 2019, Page(s) 1-6, ISBN 978-1-7281-4870-0
Éditeur: IEEE
DOI: 10.1109/3DIC48104.2019.9058886

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Auteurs: S. Dempwolf, L. Hofmann, C. Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach
Publié dans: 2017
Éditeur: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.5281/zenodo.1043259

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Auteurs: Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny
Publié dans: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors, Numéro 1, 2017
Éditeur: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.5281/zenodo.1043259

Transfer printing for heterogeneous silicon PICs

Auteurs: Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries
Publié dans: Presentation at smart Systems Integration, Numéro 1, 2019
Éditeur: Zenodo
DOI: 10.5281/zenodo.2678181

Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT

Auteurs: Fischbach, Robert; Heinig, Andy; Lienig, Jens
Publié dans: Fraunhofer EAS, Numéro 1, 2017
Éditeur: Zenodo
DOI: 10.5281/zenodo.1043277

Micro-Transfer-Printing and Potential Process Optimizations by FEA

Auteurs: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Publié dans: NTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (Eurosime 2019), Hannover, Germany, 24 - 27 March 2019, Numéro 1, 2019
Éditeur: ZENODO
DOI: 10.5281/zenodo.2677535

Micro-transfer-printing for heterogeneous integration

Auteurs: B. Corbett, Z. Li, K. Buehler, F. Naumann, U. Krieger, S. Wicht, C. A. Bower
Publié dans: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019, Page(s) 34-34, ISBN 978-4-9047-4307-2
Éditeur: IEEE
DOI: 10.23919/ltb-3d.2019.8735381

Design Methodologies and Co-Design Options for Novel 3D Technologies

Auteurs: Horst, Tilman; Fischbach, Robert; Lienig, Jens
Publié dans: Numéro 6, 2018
Éditeur: VDE Verlag
DOI: 10.5281/zenodo.3632449

MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level

Auteurs: Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas; Krojer, Matthias; Kittler, Gabriel; Naumann, Falk; Altmann, Frank; Gomez, David; Fecioru, Alin
Publié dans: Numéro 1, 2019
Éditeur: ZENODO
DOI: 10.5281/zenodo.2654502

MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA

Auteurs: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Publié dans: Numéro 1, 2019
Éditeur: zenodo
DOI: 10.5281/zenodo.2677551

Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing

Auteurs: Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank
Publié dans: International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019, Numéro 1, 2019
Éditeur: Zenodo
DOI: 10.5281/zenodo.2702429

Manufacturing Capability of Micro-Transfer Printing

Auteurs: Gomez, David; Moore, Tanya; Meitl, Matthew A.; Bonafede, Salvatore; Pearson, Andrew; Ghosal, Kanchan; Raymond, Brook; Radauscher, Erich; Kneeburg, David; Roe, Julia; Fecioru, Alin; Kelleher, Steven; Trindade, Antonio Jose; Bower, Christopher A.
Publié dans: Smart Systems Integration (SSI), Barcelona, 10-11 April 2019, Numéro 1, 2019
Éditeur: Zenodo
DOI: 10.5281/zenodo.2654512

MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly

Auteurs: Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy
Publié dans: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Fairfax, Alaska, 29 November 2017, Numéro 1, 2019
Éditeur: Zenodo
DOI: 10.5281/zenodo.2651911

Auteurs: Fischbach, Robert; Horst, Tilman; Lienig, Jens
Publié dans: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Numéro 1, 2019
Éditeur: ZENODO
DOI: 10.5281/zenodo.3234391

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