Rezultaty Websites, patent fillings, videos etc. (1) Internal and external IT communication infrastructure and project website The external IT communication infrastructure constitutes a guideline for communication of the MICROPRINCE project to external target groups including conferences, marketing measures and communication channels. Furthermore this deliverable constitutes the launch of the internal MICROPRINCE communication infrastructure including the establishment of mailing lists or a subversion server, and the MICROPRINCE website. Publikacje Peer reviewed articles (1) Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications Autorzy: Jeroen Goyvaerts, Sulakshna Kumari, Sarah Uvin, Jing Zhang, Roel Baets, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Günther Roelkens Opublikowane w: Optics Express, Issue 28/14, 2020, Page(s) 21275, ISSN 1094-4087 Wydawca: Optical Society of America DOI: 10.1364/oe.395796 Conference proceedings (7) A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems Autorzy: Robert Fischbach, Tilman Horst, Jens Lienig Opublikowane w: 2019 International 3D Systems Integration Conference (3DIC), 2019, Page(s) 1-6, ISBN 978-1-7281-4870-0 Wydawca: IEEE DOI: 10.1109/3DIC48104.2019.9058886 Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors Autorzy: S. Dempwolf, L. Hofmann, C. Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach Opublikowane w: 2017 Wydawca: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) DOI: 10.5281/zenodo.1043259 Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors Autorzy: Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny Opublikowane w: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors, Issue 1, 2017 Wydawca: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) DOI: 10.5281/zenodo.1043259 Transfer printing for heterogeneous silicon PICs Autorzy: Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries Opublikowane w: Presentation at smart Systems Integration, Issue 1, 2019 Wydawca: Zenodo DOI: 10.5281/zenodo.2678181 Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT Autorzy: Fischbach, Robert; Heinig, Andy; Lienig, Jens Opublikowane w: Fraunhofer EAS, Issue 1, 2017 Wydawca: Zenodo DOI: 10.5281/zenodo.1043277 Micro-Transfer-Printing and Potential Process Optimizations by FEA Autorzy: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk Opublikowane w: NTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (Eurosime 2019), Hannover, Germany, 24 - 27 March 2019, Issue 1, 2019 Wydawca: ZENODO DOI: 10.5281/zenodo.2677535 Micro-transfer-printing for heterogeneous integration Autorzy: B. Corbett, Z. Li, K. Buehler, F. Naumann, U. Krieger, S. Wicht, C. A. Bower Opublikowane w: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019, Page(s) 34-34, ISBN 978-4-9047-4307-2 Wydawca: IEEE DOI: 10.23919/ltb-3d.2019.8735381 Book chapters (1) Design Methodologies and Co-Design Options for Novel 3D Technologies Autorzy: Horst, Tilman; Fischbach, Robert; Lienig, Jens Opublikowane w: Issue 6, 2018 Wydawca: VDE Verlag DOI: 10.5281/zenodo.3632449 Other (6) MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level Autorzy: Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas; Krojer, Matthias; Kittler, Gabriel; Naumann, Falk; Altmann, Frank; Gomez, David; Fecioru, Alin Opublikowane w: Issue 1, 2019 Wydawca: ZENODO DOI: 10.5281/zenodo.2654502 MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA Autorzy: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk Opublikowane w: Issue 1, 2019 Wydawca: zenodo DOI: 10.5281/zenodo.2677551 Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing Autorzy: Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank Opublikowane w: International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019, Issue 1, 2019 Wydawca: Zenodo DOI: 10.5281/zenodo.2702429 Manufacturing Capability of Micro-Transfer Printing Autorzy: Gomez, David; Moore, Tanya; Meitl, Matthew A.; Bonafede, Salvatore; Pearson, Andrew; Ghosal, Kanchan; Raymond, Brook; Radauscher, Erich; Kneeburg, David; Roe, Julia; Fecioru, Alin; Kelleher, Steven; Trindade, Antonio Jose; Bower, Christopher A. Opublikowane w: Smart Systems Integration (SSI), Barcelona, 10-11 April 2019, Issue 1, 2019 Wydawca: Zenodo DOI: 10.5281/zenodo.2654512 MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly Autorzy: Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy Opublikowane w: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Fairfax, Alaska, 29 November 2017, Issue 1, 2019 Wydawca: Zenodo DOI: 10.5281/zenodo.2651911 Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing Autorzy: Fischbach, Robert; Horst, Tilman; Lienig, Jens Opublikowane w: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Issue 1, 2019 Wydawca: ZENODO DOI: 10.5281/zenodo.3234391 Wyszukiwanie danych OpenAIRE... Podczas wyszukiwania danych OpenAIRE wystąpił błąd Brak wyników
