Periodic Reporting for period 4 - OCEAN12 (Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node)
Período documentado: 2021-06-01 hasta 2022-09-30
OCEAN12 is a major “Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node" and leverage Europe leadership on Automotive and aeronautics applications.
Since the last few years, electronic components become more and more prevalent in the automotive industry. Today they create a superior value for the final customer and represent an important vector of differentiation in this industry. The share economy model, which drives innovation strategies in Smart mobility, will further increase the need for safe, cost efficient, secure, reliable and un-hackable operations, raising logically the proportion of electronics and software as a percentage of the total cost of a vehicle.
OCEAN12 aims to bring very concrete technological solutions and corresponding demonstrators to the key societal challenge of Smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors and applications design that leverage Fully Depleted Silicon On Insulator (FD-SOI) technology to offer the industry’s lowest power consuming processor and components, especially for automotive and aeronautic applications.
OCEAN12 will develop a technology platform benefitting from FDSOI design’s extreme low leakage and operating voltage (Vdd) scalability attained thank to reverse and forward body biasing (RBB/FBB) of the integrate circuit and its power system architecture. This high performance, low power solution will enable the next strategic generations of smart vehicles. This platform will rely on:
• a pilot line facility capable to manufacture advanced substrates compatible with 12FDX technology,
• the definition of path finding solutions to push 12FDX technology performances and substrates solutions for innovative sensors,
• the development of innovative designs at the forefront of state of the art to enhance FDSOI capacity and guarantee the highest level of integrated solutions,
• the manufacturing of high performance ICs using all palette of FDSOI technologies,
The produced highly integrated, reliable, ultra-low power and lower cost components will be integrated in complex embedded systems accessible to TIER-1, 2 and OEMs and answering strategic challenges of future autonomous vehicles generations (land or air). Several product demonstrators are targeted: high end microcontroller plug and play board, high performance sensors data fusion, highly integrated low power video processing, awaking systems.
A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and secure a unique FDSOI roadmap beyond the 22FDX.
OCEAN 12 finally highlights Europe’s unique leading position on FDSOI technology integrating the entire manufacturing chain in this dynamic, from substrate suppliers and foundries to TIER-1 and OEM, involving academia and RTO’s.
Since the last few years, electronic components become more and more prevalent in the automotive industry. Today they create a superior value for the final customer and represent an important vector of differentiation in this industry. The share economy model, which drives innovation strategies in Smart mobility, will further increase the need for safe, cost efficient, secure, reliable and un-hackable operations, raising logically the proportion of electronics and software as a percentage of the total cost of a vehicle.
OCEAN12 aims to bring very concrete technological solutions and corresponding demonstrators to the key societal challenge of Smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors and applications design that leverage Fully Depleted Silicon On Insulator (FD-SOI) technology to offer the industry’s lowest power consuming processor and components, especially for automotive and aeronautic applications.
OCEAN12 will develop a technology platform benefitting from FDSOI design’s extreme low leakage and operating voltage (Vdd) scalability attained thank to reverse and forward body biasing (RBB/FBB) of the integrate circuit and its power system architecture. This high performance, low power solution will enable the next strategic generations of smart vehicles. This platform will rely on:
• a pilot line facility capable to manufacture advanced substrates compatible with 12FDX technology,
• the definition of path finding solutions to push 12FDX technology performances and substrates solutions for innovative sensors,
• the development of innovative designs at the forefront of state of the art to enhance FDSOI capacity and guarantee the highest level of integrated solutions,
• the manufacturing of high performance ICs using all palette of FDSOI technologies,
The produced highly integrated, reliable, ultra-low power and lower cost components will be integrated in complex embedded systems accessible to TIER-1, 2 and OEMs and answering strategic challenges of future autonomous vehicles generations (land or air). Several product demonstrators are targeted: high end microcontroller plug and play board, high performance sensors data fusion, highly integrated low power video processing, awaking systems.
A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and secure a unique FDSOI roadmap beyond the 22FDX.
OCEAN 12 finally highlights Europe’s unique leading position on FDSOI technology integrating the entire manufacturing chain in this dynamic, from substrate suppliers and foundries to TIER-1 and OEM, involving academia and RTO’s.
OCEAN12 developed the FD-SOI European platform fostering the roadmap of this energy efficient technology to advanced nodes beyond 22nm.
• In the field of semiconductor, a new generation of engineered SOI substrates and advanced building blocks to boost transistor mobility and electrostatic behavior were developed.
• At the design level, a whole ecosystem proposed energy efficient solutions including first 18nm micro-processors blocks.
• At the system level, 14 demonstrators based on the FD-SOI technology were released, and in particular a new solid state automotive radar on 22FDX, and always-on wake-up ultra low power systems to secure automobiles.
The consortium remained focused on the success of this project and all due deliverables were uploaded.
On the dissemination side we have retrieved:
• 17 scientific papers in journal,
• 62 peer reviewed conference papers
• 40 workshops
• 14 patents
• Othe events and symposium such as EFECS yearly participation though posters
• More than 242 design Ips and a lively website: the SOI forum
Through the substrate pilot line, the numerous IPs generated in our “IP factory”, the 14 demonstrators using the FDSOI technology and its dissemination centre, the OCEAN12 project gives us the necessary knowledge to consider pushing the FDSOI technological platform towards its ultimate performances, using the frame of the future European mega fab operated in the alliance between STMicroelectronics, GlobalFoundries but also the coming CHIPS ACT Pilot line.
• In the field of semiconductor, a new generation of engineered SOI substrates and advanced building blocks to boost transistor mobility and electrostatic behavior were developed.
• At the design level, a whole ecosystem proposed energy efficient solutions including first 18nm micro-processors blocks.
• At the system level, 14 demonstrators based on the FD-SOI technology were released, and in particular a new solid state automotive radar on 22FDX, and always-on wake-up ultra low power systems to secure automobiles.
The consortium remained focused on the success of this project and all due deliverables were uploaded.
On the dissemination side we have retrieved:
• 17 scientific papers in journal,
• 62 peer reviewed conference papers
• 40 workshops
• 14 patents
• Othe events and symposium such as EFECS yearly participation though posters
• More than 242 design Ips and a lively website: the SOI forum
Through the substrate pilot line, the numerous IPs generated in our “IP factory”, the 14 demonstrators using the FDSOI technology and its dissemination centre, the OCEAN12 project gives us the necessary knowledge to consider pushing the FDSOI technological platform towards its ultimate performances, using the frame of the future European mega fab operated in the alliance between STMicroelectronics, GlobalFoundries but also the coming CHIPS ACT Pilot line.
FDSOI substrates new generation developed and qualified in terms of uniformity and defectivity,
Process and metrology technologies including plasma bonding and DRM,
Shock based and sound based always on wake up systems,
1st fast-chirp Radar chip in 22FDX technology,
New SW framework (KaF, Kalray Framework) and innovative neural network approach (KaNN, Kalray Neural Networks) for the high efficiency embedded computing design solution,
Process and metrology technologies including plasma bonding and DRM,
Shock based and sound based always on wake up systems,
1st fast-chirp Radar chip in 22FDX technology,
New SW framework (KaF, Kalray Framework) and innovative neural network approach (KaNN, Kalray Neural Networks) for the high efficiency embedded computing design solution,