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Manufacturing process for ultimate performance inertial MEMS Gyroscope (MUPIA)

Periodic Reporting for period 1 - MUPIA (Manufacturing process for ultimate performance inertial MEMS Gyroscope (MUPIA))

Reporting period: 2018-03-01 to 2019-09-30

"The MUPIA project answers on the request for ""Silicon Very High Performances MEMS Gyrometers Technology"" by merging SINTEF, a research institute and experienced manufacturer of high-performance MEMS and MICROSS, a company with expertise in assembling bare dies into standard and custom ceramic packages for demanding applications. This consortium has proven manufacturing capabilities in the key technologies requested for the volumes indicated (several thousands units/year), including high precision deep reactive ion etching (DRIE) for silicon on insulator (SOI) wafers, through silicon vias (TSVs), ceramic packages and reliability testing. The consortium will answer on the challenge of bringing the manufacturing process for the gyrometer up to a manufacturing readiness level of 5 by exploiting systematic process development and optimization procedures according to their ISO certified Management Systems.
MUPIA addresses the topic Manufacturing process for ultimate performance inertial MEMS Gyrometer (JTI-CS2-2017-CfP06-SYS-01-04) within the Programme Area SYS of the Clean Sky 2 program.
The project will last 35 months and will be completed February 2021."
During the first 19 months the MUPIA project has defined the specifications for the complete gyro and suggested the processing and packaging processes needed to accomplish the objectives and specifications. Subsequently, detailed layout design was done in parallel with process design to ensure processing compatibility. New and innovative solutions to meeting the processing specifications were tested and shown to be promising for the first round of production. A bespoke ceramic package was designed to meet the standards in the industry and a methodology for high vacuum sealing was established.
An innovative way of increasing the resolution of mask photolithography was proposed and tested and will be proven during in the coming project period. A potential impact of this process is that smaller features that previously thought could be patterned using mask lithography, reducing the necessity advancing to stepper lithography. The process will be disseminated in 2020.
At completion the MUPIA project expects to exceed state-of-the-art in accuracy obtainable for a MEMS based gyrometers at a significantly lower cost than other gyrometers with the same specifications.
A MUPIA wafer with the completed active layer