Manufacturing process for ultimate performance inertial MEMS Gyroscope (MUPIA)

Project Information

MUPIA

Grant agreement ID: 785337

DOI

10.3030/785337

Project closed

EC signature date 28 February 2018

Start date 1 March 2018

End date 31 May 2021

Funded under

• SOCIETAL CHALLENGES - Smart, Green And Integrated Transport

Total cost

€ 1 330 318,75

EU contribution

€ 1 235 723,13

Coordinated by

SINTEF AS
Norway

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (2)

Plan for Communication, Dissemination and Exploitation of project results

This report will outline a plan for how the project will handle results obtained in the project. These results might be of public interest and thus disseminated in journals etc, while other results might be of confidential manner, in which a commercial exploitation is foreseen. The report will also make a suggestion to the project partners on how information is handled in the project.

Report on Communication, Dissemination, Exploitation actions and Business plan

Websites, patent fillings, videos etc. (1)

Webpage

Internal and external web pages for project use.

Publications

Conference proceedings (3)

Wafer bonding process for zero level vacuum packaging of MEMS

Author(s): Guido Sordo, Cristian Collini, Sigurd Moe, Erik Poppe, Daniel Nilsen Wright
Published in: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-4, ISBN 978-1-7281-6293-5
Publisher: IEEE
DOI: 10.1109/estc48849.2020.9229871

Through Silicon Vias in MEMS packaging, a review

Author(s): Guido Sordo, Cristian Collini, Sigurd Moe and Daniel Nilsen Wright
Published in: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2019, ISBN 978-91-519-2089-4
Publisher: IMAPS Nordic

Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Author(s): Daniel Nilsen Wright; Branson D. Belle; Joachim S. Graff
Published in: 2020, ISBN 978-0-9568086-6-0
Publisher: IEEE
DOI: 10.5281/zenodo.3605912