First nanotechnology for the electronic packaging industry based on a room-temperature welding process

Información del proyecto

NanoWelds

Identificador del acuerdo de subvención: 785946

DOI

10.3030/785946

Proyecto cerrado

Fecha de la firma de la CE 10 Noviembre 2017

Fecha de inicio 1 Diciembre 2017

Fecha de finalización 31 Marzo 2018

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies

Coste total

€ 71 429,00

Aportación de la UE

€ 50 000,00

Coordinado por

NANOWIRED GMBH
Germany

Periodic Reporting for period 1 - NanoWelds (First nanotechnology for the electronic packaging industry based on a room-temperature welding process)

Período documentado: 2017-12-01 hasta 2018-03-31

Resumen del contexto y de los objetivos generales del proyecto

With NanoWelds, our company NanoWired GmbH aims to launch a disruptive 3D integration technique based on a nanotechnology that bonds different types of surfaces at room temperature and without using any additives in a two-step process (NanoWiring and KlettWelding).With NanoWelds we will bring electronic packaging industry one step beyond by overcoming current limitations on soldering or gluing techniques, which require high temperature and often noble or toxic metals, thus making the process economically viable for industrial production.

Trabajo realizado desde el comienzo del proyecto hasta el final del período abarcado por el informe y los principales resultados hasta la fecha

During the SME Instrument Phase 1, we covered the technical, commercial and financial feasibility of NanoWelds.
In the first part, we analyzed the status of the technology validation and compiled the feedback received from pilot customers. As a result, we defined the work plan for the development of successive prototypes and testing of the NanoWiring machine.
In the second part, a summarized analysis of the target markets is presented for the main applications of NanoWelds in the semiconductor industry. The competing solutions and companies are introduced, and the value chain is shown. We included an update as well on the commercialization plan. The IP management strategy is explained and the results of the Freedom to Operate are summarized.
In the third part, a summary on the financial viability assessment is shown that establishes the budget necessary for the development of the NanoWiring machine, and the revenues and expenses projections for the next five years.
Finally, a brief risk analysis is included, covering commercial, technical, financial and legal risks.

Avances que van más allá del estado de la técnica e impacto potencial esperado (incluida la repercusión socioeconómica y las implicaciones sociales más amplias del proyecto hasta la fecha)

NanoWired GmbH has developed a plan to control the technological risk. We have divided the work in five prototype iterations of the NanoWiring machine, from the lab-level process using university equipment (version 0) operated “manually”, towards a fully automated industrial-level prototype capable to connect with the rest of fabrication machines in current manufacturing lines (manufacturing TRL 9). In the last months during the Phase 1, we have successfully moved to prototype version 2, featuring a closed housing and a PLC-controlled unit that achieves reproducible results. Furthermore, we have conducted hundreds of tests that demonstrate the high performance of nanowelded components and contacted 19 companies that are giving us valuable feedback regarding the best applications that fit our technology.
During the Feasibility Study, we have estimated that we can grow the company from 8 to 20 highly qualified employees, from which 8 to 15 will be directly involved in conducting the future Phase 2 Project of developing the NanoWiring machine. With an investment of 3.03 million €, we expect a quick payback time after 1.5 years. NanoWired will have a direct economic and social impact, strengthening the position of European companies in the multibillion semiconductor industry.

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