First nanotechnology for the electronic packaging industry based on a room-temperature welding process

Informations projet

NanoWelds

N° de convention de subvention: 785946

DOI

10.3030/785946

Projet clôturé

Date de signature de la CE 10 Novembre 2017

Date de début 1 Decembre 2017

Date de fin 31 Mars 2018

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies

Coût total

€ 71 429,00

Contribution de l’UE

€ 50 000,00

Coordonné par

NANOWIRED GMBH
Germany

Periodic Reporting for period 1 - NanoWelds (First nanotechnology for the electronic packaging industry based on a room-temperature welding process)

Période du rapport: 2017-12-01 au 2018-03-31

Résumé du contexte et des objectifs généraux du projet

With NanoWelds, our company NanoWired GmbH aims to launch a disruptive 3D integration technique based on a nanotechnology that bonds different types of surfaces at room temperature and without using any additives in a two-step process (NanoWiring and KlettWelding).With NanoWelds we will bring electronic packaging industry one step beyond by overcoming current limitations on soldering or gluing techniques, which require high temperature and often noble or toxic metals, thus making the process economically viable for industrial production.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

During the SME Instrument Phase 1, we covered the technical, commercial and financial feasibility of NanoWelds.
In the first part, we analyzed the status of the technology validation and compiled the feedback received from pilot customers. As a result, we defined the work plan for the development of successive prototypes and testing of the NanoWiring machine.
In the second part, a summarized analysis of the target markets is presented for the main applications of NanoWelds in the semiconductor industry. The competing solutions and companies are introduced, and the value chain is shown. We included an update as well on the commercialization plan. The IP management strategy is explained and the results of the Freedom to Operate are summarized.
In the third part, a summary on the financial viability assessment is shown that establishes the budget necessary for the development of the NanoWiring machine, and the revenues and expenses projections for the next five years.
Finally, a brief risk analysis is included, covering commercial, technical, financial and legal risks.

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

NanoWired GmbH has developed a plan to control the technological risk. We have divided the work in five prototype iterations of the NanoWiring machine, from the lab-level process using university equipment (version 0) operated “manually”, towards a fully automated industrial-level prototype capable to connect with the rest of fabrication machines in current manufacturing lines (manufacturing TRL 9). In the last months during the Phase 1, we have successfully moved to prototype version 2, featuring a closed housing and a PLC-controlled unit that achieves reproducible results. Furthermore, we have conducted hundreds of tests that demonstrate the high performance of nanowelded components and contacted 19 companies that are giving us valuable feedback regarding the best applications that fit our technology.
During the Feasibility Study, we have estimated that we can grow the company from 8 to 20 highly qualified employees, from which 8 to 15 will be directly involved in conducting the future Phase 2 Project of developing the NanoWiring machine. With an investment of 3.03 million €, we expect a quick payback time after 1.5 years. NanoWired will have a direct economic and social impact, strengthening the position of European companies in the multibillion semiconductor industry.

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