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HIGHLY FLEXIBLE, HIGHLY THERMAL CONDUCTIING CERAMIC NANOFIBER COMPOSITES FOR PRINTED CIRCUIT BOARD APPLICATIONS

Project description

Thin, flexible ceramics for circuit boards

The EU-funded Flexiramics project supports Netherlands-based company Eurekite in developing a flexible material that has numerous benefits over current ceramics. It can be bent and shaped into any position, is not brittle and is fireproof. Although this fibre-based ceramic is light and flexible like tissue paper, it retains the main physiochemical properties of traditional ceramics, such as heat resistance. Eurekite plans to use the new material in a flexible printed circuit board, combining the flexibility and lightness of a polymer with the thermal and dielectric properties of a ceramic.

Objective

FLEXIRAMICS® is light and flexible like paper but 100% ceramic and has a low cost for a ceramic; it is calculated that Flexiramics® will costs 30€/m2 at production level whereas ceramic sheets costs tens of hundreds of euros. Its unique properties open new doors for the development of next generation products limited by traditionally available materials.
Flexiramics® has numerous benefits over current ceramics, in particular that it behaves like paper and can be bent and shaped into any position, and that it is not brittle. Therefore it can be used in many harsh environments without the limitations of currently available to ceramics and also providing unique thermal, electrical, catalytic and filtering characteristics.
Flexiramics® has been developed as a novel functional 100% ceramic nanofibers mat. It consists of a non-woven matrix of ceramic nanofibers, which enhances its flexibility. Furthermore, when combined with a polymer (up to 50% ceramic loading), we obtain a High Performance Film where plastic properties are improved.
Will Flexiramics Change Circuit Boards Forever? Current flex PCBs are fabricated on top of polymer substrates, which have a very low thermal conductivity. Chips and electronic components generate heat; when a substrate with low thermal conductivity is used, the chip get hotter, lose efficiency and malfunction. Flexiramics® PCBs can achieve a significant improvement in thermal conductivity, which would be beneficial for power electronics and telecommunications.
We strategically chose to work on the polymer-ceramic composite market as it is a fast-growing market and Flexiramics® can break the limitation of the ceramic loading. We choose to make Flexiramics®-PI due to the large usage of this polymer in the fields of flexible displays and PCBs.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

SME-1 - SME instrument phase 1

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-SMEInst-2016-2017

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Coordinator

EUREKITE BV
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 50 000,00
Address
DE VELDMAAT 17
7522 NM ENSCHEDE
Netherlands

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Oost-Nederland Overijssel Twente
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 71 429,00
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