Descrizione del progetto
Un tipo di ceramica sottile e flessibile per circuiti stampati
Il progetto Flexiramics, finanziato dall’UE, sostiene l’azienda Eurekite, con sede nei Paesi Bassi, nello sviluppo di un materiale flessibile che presenta numerosi vantaggi rispetto alla ceramica odierna: può infatti essere piegato e sagomato in qualsiasi posizione, non è fragile ed è ignifugo. Sebbene questa ceramica a base di fibre sia leggera e flessibile come la carta velina, conserva le principali proprietà fisico-chimiche della ceramica tradizionale, come la resistenza al calore. Eurekite prevede di utilizzare il nuovo materiale in un circuito stampato flessibile, combinando la flessibilità e la leggerezza di un polimero con le proprietà termiche e dielettriche di una ceramica.
Obiettivo
FLEXIRAMICS® is light and flexible like paper but 100% ceramic and has a low cost for a ceramic; it is calculated that Flexiramics® will costs 30€/m2 at production level whereas ceramic sheets costs tens of hundreds of euros. Its unique properties open new doors for the development of next generation products limited by traditionally available materials.
Flexiramics® has numerous benefits over current ceramics, in particular that it behaves like paper and can be bent and shaped into any position, and that it is not brittle. Therefore it can be used in many harsh environments without the limitations of currently available to ceramics and also providing unique thermal, electrical, catalytic and filtering characteristics.
Flexiramics® has been developed as a novel functional 100% ceramic nanofibers mat. It consists of a non-woven matrix of ceramic nanofibers, which enhances its flexibility. Furthermore, when combined with a polymer (up to 50% ceramic loading), we obtain a High Performance Film where plastic properties are improved.
Will Flexiramics Change Circuit Boards Forever? Current flex PCBs are fabricated on top of polymer substrates, which have a very low thermal conductivity. Chips and electronic components generate heat; when a substrate with low thermal conductivity is used, the chip get hotter, lose efficiency and malfunction. Flexiramics® PCBs can achieve a significant improvement in thermal conductivity, which would be beneficial for power electronics and telecommunications.
We strategically chose to work on the polymer-ceramic composite market as it is a fast-growing market and Flexiramics® can break the limitation of the ceramic loading. We choose to make Flexiramics®-PI due to the large usage of this polymer in the fields of flexible displays and PCBs.
Campo scientifico
- engineering and technologymaterials engineeringfibers
- engineering and technologymaterials engineeringcomposites
- natural scienceschemical sciencespolymer sciences
- engineering and technologymaterials engineeringceramics
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunications
Programma(i)
- H2020-EU.2.1.2. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies Main Programme
- H2020-EU.2.1.5. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced manufacturing and processing
- H2020-EU.2.1.3. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced materials
- H2020-EU.2.3.1. - Mainstreaming SME support, especially through a dedicated instrument
Invito a presentare proposte
Vedi altri progetti per questo bandoBando secondario
H2020-SMEINST-1-2016-2017
Meccanismo di finanziamento
SME-1 - SME instrument phase 1Coordinatore
7522 NM ENSCHEDE
Paesi Bassi
L’organizzazione si è definita una PMI (piccola e media impresa) al momento della firma dell’accordo di sovvenzione.