Description du projet
Une méthode de fabrication à température ambiante pour les composants multi-matériaux, notamment les céramiques
La fabrication de composants intégrés peut être confrontée à des défis liés à la compatibilité des processus de fabrication des différents sous-composants. La compatibilité thermique constitue un paramètre critique. Le traitement de l’électrocéramique, partie intégrante de nombreuses applications, requiert des températures extrêmement élevées. Cela constitue non seulement un obstacle pour les contacts et l’intégration avec les sous-composants, y compris ceux en polymère, mais exige également d’énormes quantités d’énergie. Le projet FUNCOMP, financé par l’UE, s’appuiera sur son processus de densification des céramiques à température ambiante et de post-traitement à très basse température pour permettre une intégration efficace des systèmes multi-matériaux. L’équipe compte évaluer ses méthodes de fabrication à température ambiante dans le cadre de la production de composants d’accéléromètres et d’antennes.
Objectif
Electroceramics are key materials in all electronics. These ceramic components are used for example in sensing of force, acceleration, and humidity, in energy harvesting, and in frequency tuning of antennas and filters. They are also used for miniaturization and packaging of electronics systems and devices. The main disadvantage of electroceramics is that the fabrication requires relatively high investments and it consumes significant amount of energy due to high sintering temperatures (850-2000 oC). This also makes limitations in contacting and an integration with other materials. However, in the last few years realization of electroceramic components with room temperature fabrication (RTF) has become possible. Our ERC project “Printed Electroceramics with Ultimate Compositions” led to extremely interesting discoveries and opens up a totally new horizons to fabricate functional composites at room temperature. The new finding to use densification process of ceramics at room temperature and post-processing at very low (120 °C) temperature opened a utilization pathway for successful multimaterial system integration.We demonstrated that RTF is feasible for realization e.g. dielectrics based on Li2MoO4 ceramics and its composites while new endeavors in integration will be done in this proposed PoC project. Three main application areas, namely wireless 5G, IoT and automotive are all eagerly looking for new approaches for integration, packaging and sensing. In this Proof-of-Concept we will focus on utilization steps to evaluate RTF composite technology in e.g. accelerometer and antenna components so that the first industrially applicable prototypes and samples can be manufactured and demonstrated.
Champ scientifique
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineering
- engineering and technologymechanical engineeringmanufacturing engineeringproduct engineering
- engineering and technologymaterials engineeringcomposites
- engineering and technologymaterials engineeringceramics
Programme(s)
Régime de financement
ERC-POC - Proof of Concept GrantInstitution d’accueil
90014 Oulu
Finlande