Descrizione del progetto
Produzione a temperatura ambiente di componenti multimateriale, compresa la ceramica
La produzione di componenti integrati può trovarsi alle prese con alcune difficoltà per quanto riguarda la compatibilità dei processi di produzione per i vari sottocomponenti. La compatibilità della temperatura è un parametro determinante. Infatti, la lavorazione dell’elettroceramica, parte integrante di molte applicazioni, richiede temperature estremamente elevate. Questo aspetto non ostacola solo il contatto e l’integrazione con i sottocomponenti, compresi quelli polimerici, ma necessita anche di enormi quantità di energia. Il progetto FUNCOMP, finanziato dall’UE, si baserà sul proprio processo di densificazione della ceramica a temperatura ambiente e sulla post-lavorazione a temperatura molto bassa per un’integrazione efficace del sistema multimateriale. Il gruppo del progetto prevede di valutare i propri metodi di fabbricazione a temperatura ambiente durante la produzione di componenti di accelerometri e antenne.
Obiettivo
Electroceramics are key materials in all electronics. These ceramic components are used for example in sensing of force, acceleration, and humidity, in energy harvesting, and in frequency tuning of antennas and filters. They are also used for miniaturization and packaging of electronics systems and devices. The main disadvantage of electroceramics is that the fabrication requires relatively high investments and it consumes significant amount of energy due to high sintering temperatures (850-2000 oC). This also makes limitations in contacting and an integration with other materials. However, in the last few years realization of electroceramic components with room temperature fabrication (RTF) has become possible. Our ERC project “Printed Electroceramics with Ultimate Compositions” led to extremely interesting discoveries and opens up a totally new horizons to fabricate functional composites at room temperature. The new finding to use densification process of ceramics at room temperature and post-processing at very low (120 °C) temperature opened a utilization pathway for successful multimaterial system integration.We demonstrated that RTF is feasible for realization e.g. dielectrics based on Li2MoO4 ceramics and its composites while new endeavors in integration will be done in this proposed PoC project. Three main application areas, namely wireless 5G, IoT and automotive are all eagerly looking for new approaches for integration, packaging and sensing. In this Proof-of-Concept we will focus on utilization steps to evaluate RTF composite technology in e.g. accelerometer and antenna components so that the first industrially applicable prototypes and samples can be manufactured and demonstrated.
Campo scientifico
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineering
- engineering and technologymechanical engineeringmanufacturing engineeringproduct engineering
- engineering and technologymaterials engineeringcomposites
- engineering and technologymaterials engineeringceramics
Programma(i)
Argomento(i)
Meccanismo di finanziamento
ERC-POC - Proof of Concept GrantIstituzione ospitante
90014 Oulu
Finlandia