Project description
Photonic chips leveraging 2D materials hold promise for quantum computing
Photonic integrated circuits use photons instead of electricity to drive the circuit components, providing a solution to the limitations of microelectronic chips such as speed, power consumption and integration density. The EU-funded 2D-SIPC project will leverage 2D materials for creating on-chip quantum components such as single-photon emitters, single-photon detectors and photonic switches. 2D-SIPC will take advantage of the great variety of 2D materials and heterostructures to fabricate novel quantum devices with revolutionary functionalities. Photonic chips leveraging 2D materials are a real breakthrough for quantum computing, quantum sensing and metrology.
Objective
The proposed project aims at developing scalable quantum networks, based on photonic chip integration of novel 2D material quantum devices, with the main goal to demonstrate all-optical on-chip quantum processing. The recent demonstration of effortless integration of 2D materials onto photonics and CMOS platforms will result in a breakthrough in the development of on-chip quantum networks. 2D-SIPC will take full advantage of the huge variety of 2D materials and heterostructures and prototype novel quantum devices with revolutionary functionalities. In particular, we will develop electrically driven and entangled single photon emitters, broadband and high temperature single photon detectors, ultra-fast waveguide integrated optical modulators and non-linear gates. To pave the way to scalable networks, 2D-SIPC will develop large scale growth techniques of the most promising 2D materials. With this unique combination of features 2D-SIPC will allow the first demonstration of on-chip optical quantum processing, a key milestone for many quantum network concepts, such as extended secure quantum communication, scaling up of quantum computers and simulators, and novel quantum sensing applications with entangled photons. In particular, as these topics cover all four Quantum Technology pillars of the Quantum Flagship, our proposal makes a strong strategic link to each one of them. Beyond the 2D-SIPC platform, each developed component will be exploited in such distant fields as biological and medical imaging, radio-astronomy and environmental monitoring. The 2D-SIPC consortium includes four academic and one industrial partner with a high degree of complementarity that are at the forefronts of their fields, including single photon detection (ICFO), theory and fabrication of 2D materials and their heterostructures (UNIMAN), single photon emission (UCAM), chip based photonic circuits (CNIT) and commercial single photon detection, single photon emission and packaging (SQ).
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology nanotechnology nano-materials two-dimensional nanostructures
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering computer hardware quantum computers
- engineering and technology medical engineering diagnostic imaging
- natural sciences physical sciences theoretical physics particle physics photons
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.1.2. - EXCELLENT SCIENCE - Future and Emerging Technologies (FET)
MAIN PROGRAMME
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H2020-EU.1.2.3. - FET Flagships
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
RIA - Research and Innovation action
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-FETFLAG-2018-2020
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
08860 Castelldefels
Spain
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.