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A revolutionary I/O Planning Solution for 2.5D & 3D Nanoelectronic Systems Design

Project description

Software tool revolutionises I/O planning of 2.5D and 3D integrated circuits

Silicon integrated circuits are approaching the maximum feasible density of transistors on a single chip. 2.5D and 3D integrated circuits could keep Moore’s law going by exploiting the vertical dimension for further integration, stacking dies on top of each other. The EU-funded HIPER project is developing software to optimise the design of the 2.5D and 3D I/O planning of all electronic components (integrated circuits, silicon interposer and chip package). The tool will help decrease electronics production costs by 30 % and lead time by 50 %. Furthermore, it will increase overall product performance as it will reduce the need for wire crossing by 65 % and total connection length by 80 %.

Objective

HIPER is an advanced EDA (Electronic Design Automation) software for the optimization of I/O Planning of 2.5-D micro/nano electronic systems. This is an important enabling technology to assist in the design of 2.5D electronics and has been developed by MONOZUKURI S.p.A. HIPER is capable of analysing, designing and optimizing the 2.5-D I/O planning of all electronic components (ICs, silicon interposer and package(s)) thanks to its software platform and revolutionary algorithms. This innovative solution will leverage a 30% reduction in the production costs, a 50% decrease in design lead-time, and an improvement in the overall product performance due to 65% reduction in wire crossing and 80% reduction in total connections length.
The $7billion EDA market is dominated by three companies, Synopsys, Cadence Design Systems and Mentor Graphics. As a result of the work undertaken so far, in the 4th quarter of 2016 we started an official partnership with Synopsys where we have been granted access to their Physical implementation platform and we are currently working together to help two customers who are taping-out HBM-based 2.5D-IC.
The solution, which is already backed by many prospective clients, targets major semiconductors companies, design houses, package manufacturers, and OSAT businesses, and is expected to be used by leading electronic companies in Europe (Italy, Germany, UK), ASIA, and USA within three years after its commercialization. The Global Electronic Design Automation market is expected to grow at a CAGR of 8.52% over the period 2016-2020 which provides an encouraging base for introducing new EDA tools. Moreover, HIPER perfectly serves the “Electronics Strategy for Europe”, adopted in May 2013 by the European Commission.

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Topic(s)

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Funding Scheme

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SME-2 - SME instrument phase 2

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-EIC-SMEInst-2018-2020

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Coordinator

MONOZUKURI - SOCIETA' PER AZIONI
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 825 300,00
Address
VIALE Castro Pretorio 122
00185 ROMA RM
Italy

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Centro (IT) Lazio Roma
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 1 179 000,00
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