MASS manufacturing of TrAnsceiveRs for Terabit/s era

Project Information

MASSTART

Grant agreement ID: 825109

DOI

10.3030/825109

Project closed

EC signature date 5 December 2018

Start date 1 January 2019

End date 30 June 2023

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost

€ 7 351 884,00

EU contribution

€ 5 999 936,25

Coordinated by

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Demonstrators, pilots, prototypes (4)

Evaluation of 400G pluggable transceiver evaluation board

Large signal characterization of 400G pluggable transceiver evaluation board prototype. Individual measurements of transmitter and receiver followed by full link validation.

Evaluation of 600G coherent transceiver

Large signal characterization of 600G coherent transceiver prototype. Individual measurements of transmitter and receiver followed by full link validation.

Evaluation of 800G pluggable transceiver evaluation board

Large signal characterization of 800G pluggable transceiver evaluation board prototype. Individual measurements of transmitter and receiver followed by full link validation.

Evaluation of 1.6T pluggable transceiver evaluation board

Large signal characterization of 1.6T pluggable transceiver evaluation board prototype. Individual measurements of transmitter and receiver followed by full link validation.

Documents, reports (6)

Updated Communication Kit

The kit will cover an up to date version of the materials based on D73 except press release

Final Press Release

Preparation of a press release announcing the project achievements and launch through suitable dissemination mechanisms

Final Publishable Activity Report

This report will consist of a publishable summary of the entire project M01M036 including overview of the results and their exploitation and dissemination conclusions on the project its socioeconomic impact of the project an uptodate link to the project website project logos diagrams photographs and videos illustrating its work if available

Factsheet and project presentation

This document contains the factsheet of the MASSTART project alongside a brief description of the project’s goals.

Report on techno economic analysis of a full manufacturing flow

Analysis of the economical constraints associated with high volume manufacturing of optical transceivers in view of the existing market needs and the projected ones looking 35 years ahead

Press Release and Communication Kit

A communication kit, which includes project facts in a common visual identity, will be prepared for the purpose of in- and outside communication. This includes a fact sheet, as well as images and powerpoint/word templates. The communication kit serves as a basis for other dissemination means such as brochures, posters and videos. In addition, the consortium aims to issue press releases.

Websites, patent fillings, videos etc. (2)

Website development and creation of social accounts

This document contains the description of the project’s website (www.masstart.eu), which will be launched in M01. In addition, the established social media pages which will act as complementary dissemination and outreach tools.

Project Video Presentation

The video aims at a general public with some technical background, however it should also be able to be used as a pitcher for the project at technical conferences and/or exhibitions It’s aim is to be eye-catching and at the same time informative.

Publications

Peer reviewed articles (1)

Silicon photonics for terabit/s communication in data centers and exascale computers

Author(s): S. Bernabé , Q. Wilmart , K. Hasharoni , K. Hassan , Y. Thonnart , P. Tissier , Y. Désières , S. Olivier , T. Tekin , B. Szelag
Published in: Solid-State Electronics Volume 179, May 2021, 107928, 2021, ISSN 0038-1101
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2020.107928

Book chapters (1)

Packaging and Test of Photonic Integrated Circuits (PICs)

Author(s): Stéphane Bernabé, Tolga Tekin, Bogdan Sirbu, Jean Charbonnier, Philippe Grosse, Moritz Seyfried
Published in: Integrated Nanophotonics: Platforms, Devices, and Applications, 2023, ISBN 9783527349128
Publisher: Wiley
DOI: 10.1002/9783527833030.ch1