MASS manufacturing of TrAnsceiveRs for Terabit/s era

Informazioni relative al progetto

MASSTART

ID dell’accordo di sovvenzione: 825109

DOI

10.3030/825109

Progetto chiuso

Data della firma CE 5 Dicembre 2018

Data di avvio 1 Gennaio 2019

Data di completamento 30 Giugno 2023

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale

€ 7 351 884,00

Contributo UE

€ 5 999 936,25

Coordinato da

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Demonstrators, pilots, prototypes (4)

Evaluation of 400G pluggable transceiver evaluation board

Large signal characterization of 400G pluggable transceiver evaluation board prototype. Individual measurements of transmitter and receiver followed by full link validation.

Evaluation of 600G coherent transceiver

Large signal characterization of 600G coherent transceiver prototype. Individual measurements of transmitter and receiver followed by full link validation.

Evaluation of 800G pluggable transceiver evaluation board

Large signal characterization of 800G pluggable transceiver evaluation board prototype. Individual measurements of transmitter and receiver followed by full link validation.

Evaluation of 1.6T pluggable transceiver evaluation board

Large signal characterization of 1.6T pluggable transceiver evaluation board prototype. Individual measurements of transmitter and receiver followed by full link validation.

Documents, reports (6)

Updated Communication Kit

The kit will cover an up to date version of the materials based on D73 except press release

Final Press Release

Preparation of a press release announcing the project achievements and launch through suitable dissemination mechanisms

Final Publishable Activity Report

This report will consist of a publishable summary of the entire project M01M036 including overview of the results and their exploitation and dissemination conclusions on the project its socioeconomic impact of the project an uptodate link to the project website project logos diagrams photographs and videos illustrating its work if available

Factsheet and project presentation

This document contains the factsheet of the MASSTART project alongside a brief description of the project’s goals.

Report on techno economic analysis of a full manufacturing flow

Analysis of the economical constraints associated with high volume manufacturing of optical transceivers in view of the existing market needs and the projected ones looking 35 years ahead

Press Release and Communication Kit

A communication kit, which includes project facts in a common visual identity, will be prepared for the purpose of in- and outside communication. This includes a fact sheet, as well as images and powerpoint/word templates. The communication kit serves as a basis for other dissemination means such as brochures, posters and videos. In addition, the consortium aims to issue press releases.

Websites, patent fillings, videos etc. (2)

Website development and creation of social accounts

This document contains the description of the project’s website (www.masstart.eu), which will be launched in M01. In addition, the established social media pages which will act as complementary dissemination and outreach tools.

Project Video Presentation

The video aims at a general public with some technical background, however it should also be able to be used as a pitcher for the project at technical conferences and/or exhibitions It’s aim is to be eye-catching and at the same time informative.

Pubblicazioni

Peer reviewed articles (1)

Silicon photonics for terabit/s communication in data centers and exascale computers

Autori: S. Bernabé , Q. Wilmart , K. Hasharoni , K. Hassan , Y. Thonnart , P. Tissier , Y. Désières , S. Olivier , T. Tekin , B. Szelag
Pubblicato in: Solid-State Electronics Volume 179, May 2021, 107928, 2021, ISSN 0038-1101
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2020.107928

Book chapters (1)

Packaging and Test of Photonic Integrated Circuits (PICs)

Autori: Stéphane Bernabé, Tolga Tekin, Bogdan Sirbu, Jean Charbonnier, Philippe Grosse, Moritz Seyfried
Pubblicato in: Integrated Nanophotonics: Platforms, Devices, and Applications, 2023, ISBN 9783527349128
Editore: Wiley
DOI: 10.1002/9783527833030.ch1