The Mnemosyne prototype is a game-changer for high-speed, high-reliability, high-density, and radiation-tolerant space applications. It replaces OTP PROM, EEPROM, and first-generation Toggle MRAM, increasing capacity by a factor of 8 to 1000. Compared to existing NOR FLASH, it maintains the same capacity while enhancing radiation tolerance from 20 Krad to 100 Krad. Additionally, it offers SEL/SEU/SEFI immunity up to 60 MeV.cm²/mg, unmatched by NOR FLASH. The Mnemosyne prototype offers unique density and reliability advantages over CBRAM, PCRAM, and ReRAM. Designed for both MCU/FPGA program memories chips, it is ideal for configuring large SRAM-based FPGAs, supporting high-performance systems and "New Space" projects in the European space industry. This is the perfect companion of the next generation of FPGA supported by Europe.
Additionally, Mnemosyne provides 128 Mb standalone space NVM and outputs space NVM IPs or macros for next-generation high-performance ASIC designs. This enhancement will significantly boost the performance of European high-performance or high-reliability ASICs, allowing European satellites to compete effectively with non-European suppliers without export/import issues.
The MNEMOSYNE project strengthens the EU's position in the space industry and significantly impacts the field of Electrical, Electronic, and Electromechanical (EEE) components, which has been dominated by players outside Europe. By enhancing Europe's non-dependence on space access, the Mnemosyne prototype becomes a crucial component for many space systems. This aligns with the Harmonised European Space Technology Roadmaps, particularly in microelectronics: ASIC & FPGA.
The key innovations of the project are listed below:
-The first European RHBD (radiation hardened by design) space NVM with density higher than 1Mb;
-The first European embedded RHBD high performance space NVM IP core on process lower than 28nm;
-The first new generation Spin-Transfer Torque (STT) MRAM for space application;
-The first RHBD applied on 22nm FDSOI on both digital and analog IPs’ for TID & SEE mitigations;
-A space product family prototypes from 128Mb to 1Gb with not only required serial interface and also additional parallel interface are available.
Achieving TRL5 by the end of the project, full production of the chip is expected soon. This development is in line with the EU effort to reduce EEE components imports from 85% to 50%.
Furthermore, radiation-hardened MRAM and embedded NVM IP cores positively impact aviation, ground, and accelerator applications. Thus, increasing the global competitiveness of European industry vendors, offering reliable and safe systems in markets where failure is not an option