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Towards the neW era of 1.6 Tb/s System-In-Package transceivers for datacenter appLIcations exploiting wafer-scale co-inteGration of InP membranes and InP-HBT elecTronics

Project description

Meeting tomorrow's data transmission needs sustainably

Field of science

  • /social sciences/economics and business/business and management/commerce
  • /natural sciences/physical sciences/optics

Call for proposal

H2020-ICT-2019-2
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Address
Patission Str. 42
10682 Athina
Greece
Activity type
Research Organisations
EU contribution
€ 798 750

Participants (5)

TECHNISCHE UNIVERSITEIT EINDHOVEN
Netherlands
EU contribution
€ 1 505 065
Address
Groene Loper 3
5612 AE Eindhoven
Activity type
Higher or Secondary Education Establishments
III-V LAB
France
EU contribution
€ 990 532,50
Address
1 Avenue Augustin Fresnel Campus Polytechnique
91767 Palaiseau Cedex
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
KUNGLIGA TEKNISKA HOEGSKOLAN
Sweden
EU contribution
€ 520 373,75
Address
Brinellvagen 8
100 44 Stockholm
Activity type
Higher or Secondary Education Establishments
ARGOTECH AS
Czechia
EU contribution
€ 616 500
Address
Holubova 978
547 01 Nachod
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
MELLANOX TECHNOLOGIES LTD - MLNX
Israel
EU contribution
€ 649 400
Address
Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)