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Towards the neW era of 1.6 Tb/s System-In-Package transceivers for datacenter appLIcations exploiting wafer-scale co-inteGration of InP membranes and InP-HBT elecTronics

Project description

Meeting tomorrow's data transmission needs sustainably

Consumers demand increasingly fast and reliable access to ever-growing volumes of data, and service providers are racing to meet the challenge. 5G, or fifth-generation, cellular services are already being rolled out, cloud-based data applications are becoming the standard and the Internet of things (IoT) is taking form. Data centres and data centre interconnects will prefer optoelectronics with the lowest latencies and power consumptions and the largest capacities. The EU-funded TWILIGHT project plans to give them what they want and need with optical transceivers capable of 1.6 trillion bits of data per second. Aside from massive capacity, the technology promises significant energy savings translating to reduced operating costs and lower environmental footprint.

Objective

IoT, 5G and cloud applications have created a huge growth of datacentre traffic fuelling the market of 400GbE and the ratification of 800GbE and 1.6T standards expected within 2013-2025. Datacentre operators must keep pace with the increasing speeds and to cope with the increasing power consumption required for airflow management and cooling. Moreover, they must address the massive interconnectivity between servers and switches dictated by 5G ultra-low latency applications. 100Gb/s per lane is the next step for the realization of 800GbE modules but this will be the end of pluggables and the start of co-packaged optics with ASICs paving the way to 1.6T and beyond. TWILIGHT aims to bring InP membranes and InP-HBT electronics at unprecedently close distances (<20um) to unleash the speed capabilities of its high performance components and to enable 112Gbaud per lane. Wafer-scale bonding together with high-accuracy assembly and co-packaging concepts, TWILIGHT’s optoelectronic engines will be capable of up to 1.6T capacity. Selective area growth will be exploited to develop C-band and O-band EMLs and UTC photodiodes in combination with echelle gratings on the same system-on-chip platform. Adaptation of the SAG layerstack will be used to develop polarization insensitive SOAs enabling complex functionalities on chip. TWILIGHT will leverage analog bandwidth interleaving for interfacing its transceivers with next generation 112G SERDES and will develop analog (de)multiplexers, >110GHz linear drivers and 100GHz TIAs. TWILIGHT will exploit the PI-SOAs to develop 4x4 and16x16 optical space switches exhibiting nanosecond latency and >50% smaller footprint. The O-band and C-band SiP transceiver demonstrators leverage up to 72% and 74% power consumption savings compared to established technologies and target the datacentre market (2-10km) and DCI (<40km), respectively, with estimated cost 0.89€/Gb/s. Exploitation of TWILIGHT’s technologies is aimed via its industrial partner MLNX.

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(opens in new window) H2020-ICT-2018-20

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Coordinator

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 798 750,00
Address
PATISION 42
106 82 ATHINA
Greece

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 798 750,00

Participants (5)

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