Project description
Big plans for photonic integration
Imagine shrinking complex and often big optical systems on a tiny chip; this is known as photonic integration. It is the dominant technology in high bandwidth communications and is set to take over in many fields of photonics. Swiss company LIGENTEC has developed a thick silicon nitride (SiN) technology that enables the manufacturing of photonic integrated circuits (PICs) using processes of better performance and lower cost than common approaches. The technology has reached TRL 7 and gained a lot of customer traction in prototyping. The EU-funded SPECTRA project will industrialise the manufacturing processes and prepare for scale-up including a quality control line for production. It will also certify the technology to industry standards.
Objective
The Sensing and Communication markets are predicted to increase tremendously over the next few years, especially pushed from medical instrumentation, diagnostics, autonomous driving, quantum computing and communication. Photonic Integration, the ability to shrink complex optical systems on a small chip, is one of the key technologies with an enabling and highly disruptive potential in those verticals.
LIGENTEC has developed a unique thick Silicon Nitride (SiN) technology which enables the manufacturing of Photonic Integrated Circuits (PICs) at better performance and lower cost than common approaches. The technology has reached TRL 7 and gained a lot of customer traction in prototyping.
LIGENTEC has estimated its serviceable available market in the Sensing and Communication segments of €400m by 2023 and €1.5bn by 2027 respectively. First customers are ready to enter volume manufacturing in 2022/2023.
This EIC project focus is to industrialise the manufacturing processes and prepare for scale-up including a quality control line for production and certify the technology to industry standards. It is strategic to the company as it enables LIGENTEC to enter the volume market.
At the end of this project LIGENTEC will:
• Have World leading PIC technology for quantum, LiDAR and Space vertical at industrial scale
• Setup and validated a quality control and metrology line
• Have certified reference designs to industry standards allowing easier design for customers enabling new applications in new markets
• Be ready to enter volume market and acquire customers with a need of PICs up to 1’000’000 units / year
• Have demonstrated increased production repeatability, yield and proven product reliability
LIGENTEC is managed by an experienced team which has successfully scaled a high-tech business in photonics in the past.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology mechanical engineering manufacturing engineering
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering computer hardware quantum computers
- natural sciences chemical sciences inorganic chemistry metalloids
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.2.3. - INDUSTRIAL LEADERSHIP - Innovation In SMEs
MAIN PROGRAMME
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H2020-EU.3. - PRIORITY 'Societal challenges
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H2020-EU.2.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
SME-2 - SME instrument phase 2
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-EIC-SMEInst-2018-2020
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
1024 ECUBLENS
Switzerland
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.