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Contenu archivé le 2024-04-19

ADHESIVE BONDING FOR HIGH TEMPERATURE APPLICATIONS

Objectif



The proposed work will investigate the use of high temperature adhesives for industrial use with composites and metals where safety-critical structures need to withstand temperatures ranging fron -55 TO 180 C. Adhesives and adhesive joint will be assesed in terms of their mechanical behaviour and degradation characteristics due to high temperature and moisture. The effect of chemical/physical modifications to the adhesive systems will also be studied with the aim of improving their performance in service and during processing. Numerical models of joints, developed in the programme, will assist in the generation of a design philosophy for bonded laminates.

An industrial requirement for safety-critical high temperature structures is likely within the decade, requiring significant improvements in structural design where adhesive bonding of advanced materials may be an enabling technology.

Champ scientifique (EuroSciVoc)

Programme(s)

Thème(s)

Appel à propositions

Données non disponibles

Régime de financement

CSC - Cost-sharing contracts

Coordinateur

British Aerospace plc
Contribution de l’UE
Aucune donnée
Adresse
Sowerby Research Centre
BS12 7QW Filton
Royaume-Uni
Coût total
Aucune donnée

Participants (7)