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ADHESIVE BONDING FOR HIGH TEMPERATURE APPLICATIONS

Objective



The proposed work will investigate the use of high temperature adhesives for industrial use with composites and metals where safety-critical structures need to withstand temperatures ranging fron -55 TO 180 C. Adhesives and adhesive joint will be assesed in terms of their mechanical behaviour and degradation characteristics due to high temperature and moisture. The effect of chemical/physical modifications to the adhesive systems will also be studied with the aim of improving their performance in service and during processing. Numerical models of joints, developed in the programme, will assist in the generation of a design philosophy for bonded laminates.

An industrial requirement for safety-critical high temperature structures is likely within the decade, requiring significant improvements in structural design where adhesive bonding of advanced materials may be an enabling technology.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

British Aerospace plc
Address
Sowerby Research Centre
BS12 7QW Filton
United Kingdom

Participants (7)

Aérospatiale Société Nationale Industrielle SA
France
Address
12 Rue Pasteur
92152 Suresnes
BHP GROUP LIMITED
Ireland
Address
Unit 4-Enterp.cent. New Road
61 Limerick
British Aerospace plc
United Kingdom
Address
B5502 Filton
BS99 7AR Bristol
Dornier Luftfahrt GmbH
Germany
Address
An Der Bundesstraße 31
88039 Friedrichshafen
Fraunhofer-Gesellschaft zur Förderungder Angewandten Forschung e.V.
Germany
Address
Kantstraße
14513 Teltow
MBB GMBH
Germany
Address

8000 München
UNIVERSITY OF BRISTOL
United Kingdom
Address
Queen's Building Univ. Walk
BS8 1TR Bristol