CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.
Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .
Resultados aprovechables
The objectives of this project is to produce and demonstrate a cooling technology based on metal matrix composites (MMC) materials heat pipes (HP). The enhanced technology is dedicated to the thermal management of high dissipative electronic devices (hot spots) having heat densities more than 10 Watts/cm 2 .
The main achievements are :
I. A hydrodynamical model has been developed for prediction and optimization :
-Simulation of all micro heat pipes geometries,
-Prediction of the capillary limit,
-Prediction of the optimum fill charge,
-Selection of the optimum geometry as a function of various parameters (wick),
-Prediction of the thermal resistance for fixed heat input and fixed fill charge,
-Prediction of the wall temperatures of the evaporator and condenser.
II. Experimental investigations have been carried out to understand and confirm the models:
-Charging procedures and set-up,
-Sealing procedures and set-up,
-Leak testing,
-Visualisation and thermographical analysis.
III. MMC manufacturing and joining techniques have been developed :
-Infiltration of porous preforms,
-Net shape casting process,
-Electrolytic plating,
-Development of leak tight soldering techniques for MMC.
IV. The integration techniques of the flat MHP in the Avionic and Telecom demonstrator
have been performed,
V. The evaluation tests have confirmed the performances of HP under static and dynamic
environmental conditions (Accelerations up to 5 G).
Metal Matrix Composite Heat Pipes have been sucessfully developed that meet the Avionic and Telecom requirements :
-This has been rendered possible through transnational complementary very efficient collaboration,
-The programme has improved the knowledge and capabilities among the partners to face the new challenging thermal packaging demands for high dissipative components,
-Possible applications have been identified in the Consortium,
-The partners based on experience gained and results obtained wish to continue the cooperation through the MCUBE forthcoming programme.
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