Objective
The objective of the project is to develop an advanced CAD tool for the correction of resist heating effects in electron beam lithography (EBL). This will allow designers to simulate and compensate for distortions due to the resist heating effects and thus enable the fabrication of microelectronics structures without distortions. The software tool will be designed for industrial application in the most advanced process of sub-micron microelectronics technology - variable shaped EBL.
The heating effect correction program will be integrated into the commercially available post-processor SiCat and the proximity correction tool PROXECCO enabling correction of both proximity and heating effects.
A physical model of the resist heating effect will be built for this purpose. The correctness of model and software will be proven by experimental verification.
Topic(s)
Data not availableCall for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
81371 München
Germany