Advanced metalisation for ulsi applications metal silicides and chemical vapour deposited tungsten

Objective

Low mechanical stress and low, uniform electrical resistivity are of crucial importance for metallisation of IC devices with feature sizes of deep submicron (below 0.5 um) dimensions. Two major research areas of interest are investigated in order to enhance circuit performance and to improve yield:
SALICIDE TiSi2 is employed for local metallisation of IC devices. The formation, morphology and thermal stability of TiSi2 will be studied on patterned structures of deep submicron dimensions. Simple modifications to the fabrication process are implemented to improve the silicide formation and thermal stability.
The W plug technology with a W/TiN/Ti stack is utilised to realise multilayer-multilevel metallisation. CVD-W is deposited on
sputter-deposited TiN/Ti adhesion layers. Different process techniques (post-annealing of TiN/Ti, modification of W deposition) are investigated, in order to control the high mechanical stresses and impurity levels in the W layers.

Fields of science

• natural sciences › physical sciences › electromagnetism and electronics
• natural sciences › chemical sciences › inorganic chemistry › transition metals
• natural sciences › chemical sciences › inorganic chemistry › post-transition metals

Programme(s)

• FP4-TMR - Specific research and technological development programme in the field of the training and mobility of researchers, 1994-1998

Topic(s)

• 0302 - Post-doctoral research training grants
• TI05 - Electronics

Call for proposal

Data not available

Funding Scheme

RGI - Research grants (individual fellowships)

Coordinator

Kungliga Tekniska Högskolan

Address

229,electrum 229
164 40 Stockholm Kista
Sweden

Participants (1)

Not available

France