Objective
Adhesive conductive pastes (ACP) used for assembling micro-modules to RF antennas of dual interface smart cards (contact and RF contact less) require oven curing before becoming conductive. This prevents cards from being function tested "in-line" and can result in card body distortion. The project aims to develop/characterise/qualify new adhesive conductive pastes/processing routes/equipment for complete " in-line" production and testing of cards. A model for predicting adhesive bond properties will be developed. The scientific phenomena of micro-wave curing will be explored. The project will reduce scarps rates, improve product reliability, consolidate European leadership and employment in smart cards, open new avenues in electronic packaging and reduce the use of lead. It will promote citizen services (IST) using cost effective and reliable smart cards.
A new Isotropic Conductive adhesive has been produced and validated. New process route developed, tested and qualified by end -users. New equipment designed, installed and tested in real industrial environment. A model for predicting smart card properties developed. Scientific base for micro-ware curing has being developed.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
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Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
13382 MARSEILLE
France